Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature

Li, Jinhui; Liu, Qiang; Zhang, Guoping; Zhao, Bin; Sun, Rong; Wong, Ching‐Ping

doi:10.1109/ectc.2017.295

Cited by 3 publications

(1 citation statement)

References 13 publications

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“…PPC has a low decomposition temperature of about 210 • C, which allows it to depolymerize when heated to an appropriately high temperature, thus facilitating bond pair separation [73]. Li et al designed a three-dimensional crosslinked polyurethane (3DPU) based on thermal reversible Diels-Alder (DA) chemistry [56]. The reaction products of the DA reaction are unstable at high temperatures.…”

Section: Thermal Slidementioning

confidence: 99%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Section: Thermal Slidementioning

confidence: 99%