Thermal modification of OSB-strands by a one-step heat pre-treatment – Influence of temperature on weight loss, hygroscopicity and improved fungal resistance

Paul, Wulf; Ohlmeyer, Martin; Leithoff, H.

doi:10.1007/s00107-006-0146-4

Cited by 59 publications

(40 citation statements)

References 19 publications

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“…It is also observed that the decreasing trend of the MOE is less than the decrease of MOR, which was also observed by several authors 9,10,15,32 .…”

Section: Mechanical Propertiessupporting

confidence: 82%

“…According to Paul et al 15 e Mendes et al 9 , the decrease in bulk density of the panels may be related to chemical degradation of some wood polymers, especially polyoses, and also the release of tensions of panels pressing.…”

Section: Bulk Density Moisture and Thicknessmentioning

confidence: 99%

“…They have shown promise, because normally the heat treatment of the previously consolidated panels enhances the dimensional stability and resistance to xylophagous attack [9][10][11][12][13][14] . However, heat treatment in the panels could also reduce the mechanical properties 10,15 .…”

Section: Introductionmentioning

confidence: 99%

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The Effect of Post-Heat Treatment in MDF Panels

et al. 2017

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This study was to evaluate the effect of post-heat treatment on the physical and mechanical properties of MDF (Medium Density Fiberboard) panels. Commercial MDF panels were produced in Brazil using Pinus wood and urea-formaldehyde (UF) adhesive. The post-heat treatments were carried in a factorial 3 x 2 (three temperatures of heat treatment -200, 225 and 250 °C, and two times -5 and 10 minutes), and a control treatment (without heat treatment). Subsequently, the physical and mechanical tests were performed. From the results it can be concluded that: 1) The most effective thermal post-treatment for improving the dimensional stability of the MDF was applied at 225 ° C and 10 min; 2) All the thermally treated panels revealed a significant decrease in the modulus of rupture and modulus of elasticity (MOR and MOE) to bending when compared with the control panels without post-heat treatment.

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“…It is also observed that the decreasing trend of the MOE is less than the decrease of MOR, which was also observed by several authors 9,10,15,32 .…”

Section: Mechanical Propertiessupporting

confidence: 82%

Section: Bulk Density Moisture and Thicknessmentioning

confidence: 99%

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The Effect of Post-Heat Treatment in MDF Panels

et al. 2017

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“…ML is frequently correlated with TMT intensity and other properties such as durability, moisture behavior, and strength properties (Metsä-Kortelainen et al 2006;Brischke et al 2007;Paul et al 2007;Welzbacher et al 2007;Meyer et al 2011). By contrast, for chemical modification (CM) processes, the uptake of solid agents remaining after drying (weight percent gain [WPG]) is considered as a measure of modification intensity (Li et al 2000;Lande et al 2004;Mai and Militz 2004;Hill 2007).…”

Section: Introductionmentioning

confidence: 99%

Critical moisture conditions for fungal decay of modified wood by basidiomycetes as detected by pile tests

Meyer

Brischke

Treu³

et al. 2015

Holzforschung

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Abstract:The aim of cell wall modification is to keep wood moisture content (MC) below favorable conditions for decay organisms. However, thermally modified, furfurylated, and acetylated woods partly show higher MCs than untreated wood in outdoor exposure. The open question is to which extent decay is influenced by the presence of liquid water in cell lumens. The present paper contributes to this topic and reports on physiological threshold values for wood decay fungi with respect to modified wood. In total, 4200 specimens made from acetylated, furfurylated, and thermally modified beech wood (Fagus sylvatica L.) and Scots pine sapwood (sW) (Pinus sylvestris L.) were exposed to Coniophora puteana and Trametes versicolor. Piles consisting of 50 small specimens were incubated above malt agar in Erlenmeyer flasks for 16 weeks. In general, pile upward mass loss (ML) and MC decreased. Threshold values for fungal growth and decay (ML ≥ 2%) were determined. In summary, the minimum MC for fungal decay was slightly below fiber saturation point of the majority of the untreated and differently modified materials. Surprisingly, T. versicolor was able to degrade untreated beech wood at a minimum of 15% MC, and growth was possible at 13% MC. By contrast, untreated pine sW was not decayed by C. puteana at less than 29% MC.

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“…Some studies have reported the influence of thermal treatment on the conventional particleboard-type wood panels, such as flakeboard, waferboard, MDF, and OSB, which have been proved promising, because, usually, heat treatment in already-consolidated panels provides improved dimensional stability and resistance to xylophage attack 13,19,20,21,22,23,24 . However, heat treatment in panels can also promote reduction of their mechanical properties 14,19,25 . In this context, the present study aimed to evaluate the effect of heat treatment on the physical and mechanical properties of particleboard from sugarcane bagasse.…”

Section: Introductionmentioning

confidence: 99%

Effect of Post-production Heat Treatment on Particleboard from Sugarcane Bagasse

et al. 2015

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This study aimed to evaluate the effect of heat treatment on the physical and mechanical properties of particleboard from sugarcane bagasse. The experiment consisted of seven treatments arranged in a 2 × 3 factorial arrangement (two heat treatment times -8 and 12 min, and three heat treatment temperatures -200 °C, 230 °C, and 260 °C) and treatment control (without heat treatment). We evaluated the properties such as apparent density, water absorption after 2 and 24 h (WA2h andWA24h), thickness swell after 2 and 24 h (TS2h and TS24h), irreversible thickness swelling rate (ITS), internal bond, Modulus of Elasticity (MOE), and Modulus of Rupture (MOR) in static bending. In general, the use of heat treatment appeared very promising for improving the dimensional stability of sugarcane bagasse particleboard, without being made unviable by the mechanical properties reduction.

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Thermal modification of OSB-strands by a one-step heat pre-treatment – Influence of temperature on weight loss, hygroscopicity and improved fungal resistance

Cited by 59 publications

References 19 publications

The Effect of Post-Heat Treatment in MDF Panels

The Effect of Post-Heat Treatment in MDF Panels

Critical moisture conditions for fungal decay of modified wood by basidiomycetes as detected by pile tests

Effect of Post-production Heat Treatment on Particleboard from Sugarcane Bagasse

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