Thermal model design and analysis of the high-power LED automotive headlight cooling device

Zhao, Xiao‐Qi; Cai, Yixi; Wang, Jing; Li, Xiaohua; Chun, Zhang

doi:10.1016/j.applthermaleng.2014.09.066

Cited by 58 publications

(24 citation statements)

References 17 publications

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“…Furthermore, air cooling by means of buoyancy driven convection increases the reliability and reduces the operational costs compared to forced convection cooling because no fan is required. A relatively new application for buoyancy driven convection is the cooling of LEDs (Light Emitting Diodes) in automotive and domestic applications [1]. During their operation, LEDs generate heat.…”

Section: Open-cell Metal Foams: Advantages and Nomenclaturementioning

confidence: 99%

Buoyancy driven convection in open-cell metal foam using the volume averaging theory

Schampheleire

Kerpel

Jaeger

et al. 2015

Applied Thermal Engineering

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Section: Open-cell Metal Foams: Advantages and Nomenclaturementioning

confidence: 99%

Buoyancy driven convection in open-cell metal foam using the volume averaging theory

Schampheleire

Kerpel

Jaeger

et al. 2015

Applied Thermal Engineering

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“…The reliability of electronics restricts the wider application of high-power LED. Poor heat dissipation can influence high-power LED's reliability such as the service life and the light efficiency [6][7][8]. And there are some papers showing that if the temperature of the LED device rises to 2 ∘ C, the reliability can be reduced 2%-10% [8,9].…”

Section: Introductionmentioning

confidence: 99%

Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Zhang

Yin

2017

Advances in Materials Science and Engineering

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The reliability of high-power light-emitting-diode (LED) devices strongly depends on the die-attach quality because voids may increase junction temperature and total thermal resistance of LED devices. Die-attach material has a key role in the thermal management of high-power LED package by providing low-contact thermal resistance. Thermal and mechanical analyses were carried out by experiments and thermal simulation. The quantitative analysis results show that thermal resistance of die-attach layer (thermal resistance caused by die-attach material and voids in die-attach layer) plays an important role in total thermal resistance of high-power LED packaging according to the differential structure function of thermal transient characteristics. The increase of void fraction in die-attach layer causes the increases of thermal resistance of die-attach layer; the thermal resistance increased by 1.95 K/W when the void fraction increased to 62.45%. The voids also make an obvious influence on thermal stress and thermal strain of chip; the biggest thermal stress of chip was as high as 847.1 MPa compared to the 565.2 MPa when the void fraction increases from being void-free to 30% in the die-attach layer.

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“…For automotive applications, Yu et al [109], Park and Lee [110], and Jang et al [111] studied the heat sink design considering fin thickness, fin height, number of fins, base plate area, and heat sink shape. Zhao et al designed a passive air cooling system with heat conductive plates to improve the heat dissipation [112]. Active or forced air cooling has also been investigated for headlamp cooling systems.…”

Section: Systemmentioning

confidence: 99%

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics; (2) practical thermal management solutions for GaN power electronics; and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.

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Thermal model design and analysis of the high-power LED automotive headlight cooling device

Cited by 58 publications

References 17 publications

Buoyancy driven convection in open-cell metal foam using the volume averaging theory

Buoyancy driven convection in open-cell metal foam using the volume averaging theory

Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

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