Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop

Gao, Bing; Yang, Fan; Chen, Minyou; Chen, Yigao; Lai, Wu‐Wei; Liu, Chao

doi:10.1016/j.microrel.2017.12.046

Cited by 37 publications

(17 citation statements)

References 17 publications

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“…Finite element modelling is compact and result-oriented and hence widely popular among engineering community [19]. It has the capability to apply different types of boundary and loading conditions.…”

Section: A Finite Element (Fe) Modellingmentioning

confidence: 99%

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Reliability Assessment of IGBT Through Modelling and Experimental Testing

et al. 2020

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Lifetime of power electronic devices, in particular those used for wind turbines, is short due to the generation of thermal stresses in their switching device e.g., IGBT particularly in the case of high switching frequency. This causes premature failure of the device leading to an unreliable performance in operation. Hence, appropriate thermal assessment and implementation of associated mitigation procedure are required to put in place in order to improve the reliability of the switching device. This paper presents two case studies to demonstrate the reliability assessment of IGBT. First, a new driving strategy for operating IGBT based power inverter module is proposed to mitigate wire-bond thermal stresses. The thermal stress is characterised using finite element modelling and validated by inverter operated under different wind speeds. High-speed thermal imaging camera and dSPACE system are used for real time measurements. Reliability of switching devices is determined based on thermoelectric (electrical and/or mechanical) stresses during operations and lifetime estimation. Second, machine learning based data-driven prognostic models are developed for predicting degradation behaviour of IGBT and determining remaining useful life using degradation raw data collected from accelerated aging tests under thermal overstress condition. The durations of various phases with increasing collector-emitter voltage are determined over the device lifetime. A data set of phase durations from several IGBTs is trained to develop Neural Network (NN) and Adaptive Neuro Fuzzy Inference System (ANFIS) models, which is used to predict remaining useful life (RUL) of IGBT. Results obtained from the presented case studies would pave the path for improving the reliability of IGBTs. INDEX TERMS Reliability, power electronics, IGBT, finite element analysis, accelerated aging test, data-driven prognostics, machine learning.

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Section: A Finite Element (Fe) Modellingmentioning

confidence: 99%

“…Therefore, it is not quite technically feasible to assess reliability of a product under normal operating condition. Accelerated aging experiment allows assessment of reliability within a much shorter time by accelerating the failure of an electronic product [19].…”

Section: B Experimental Set-up For Igbt Degradationmentioning

confidence: 99%

Reliability Assessment of IGBT Through Modelling and Experimental Testing

et al. 2020

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“…This newly proposed method involves calculating the damage caused by predominant failure mechanisms such as solder joint fatigue and using it as feedback to the thermal model. As the crack propagates through the solder joint of the IGBT/diode, this will result in an increase in the thermal resistance of the IGBT/diode whereas the capacitance is less sensitive to damage and as such is assumed to be constant in the new model [42]. The increase of the thermal loading as more damage in the solder joint is captured in this model and as such will reduce the lifetime expectancy of the IGBT/diode compared with the traditionally used linear model [42].…”

Section: Figure 2-influence Of the Thermal Behaviour Of The Igbt On Itsmentioning

confidence: 99%

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Simpson

Egea‐Àlvarez

Collu

2020

2020 9th International Conference on Renewable Energy Research and Application (ICRERA)

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Offshore wind energy is currently the leading offshore renewable energy technology and plays an essential role in achieving a low carbon economy in Europe. Offshore wind turbines, as a result of the harsher offshore environment, suffer from high O&M costs, and as such a high overall LCOE. These higher O&M costs can be reduced by focusing on the most critical subassemblies of the OWT, by either improving the reliability of the subassembly or by better understanding the failure mechanism, and thus optimizing the O&M strategy. The power converter is identified as one of the most critical subassemblies as risk of the operation of the OWT in terms of maintainability and availability. The reliability of the power converter is heavily influenced by both its steady-state and its dynamic thermal behavior, and as such great attention will be paid to the literature related to the thermal behaviour of the power converter. This paper seeks to provide a comprehensive overview on how the typical mission profile of an OWT influences the thermal loading. The paper seeks to propose a comprehensive and up-to-date literature review related to the lifetime modelling of the power converter, and to highlight some of the main challenges yet to be tackled in the reliability analysis of the power converter, suggesting future areas of research.

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“…An application of the results found in this work can be used for the lifetime estimation of semiconductor devices. One can find several methods to evaluate the end-of-life of semiconductor devices in [20][21]. For example, the number of cycles to failure, Nf, can be obtained from the Coffin-Manson-Arrhenius model expressed as [20]:…”

Section: Implications On Reliability Estimationmentioning

confidence: 99%

Non-uniform Temperature Distribution Implications on Thermal Analysis Accuracy of Si IGBTs and SiC MOSFETs

Akbari

Bahman

Reigosa

et al. 2018

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Being the power loss and temperature distribution in power-electronics semiconductor dies influenced by one another, this paper demonstrates that neglecting such an effect can result in significant errors in electro-thermal simulations and mistaken calculation of junction temperatures. Two case studies on different semiconductor technologies, namely Silicon Insulated-Gate Bipolar Transistors (IGBTs) and Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), are presented to corroborate the paper findings. Resultant temperature distributions are obtained by a proposed flowchart, which accepts the corresponding power dissipation input from MATLAB environment and employs a finite element based analysis implemented in COMSOL Multiphysics environment.

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Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop

Cited by 37 publications

References 17 publications

Reliability Assessment of IGBT Through Modelling and Experimental Testing

Reliability Assessment of IGBT Through Modelling and Experimental Testing

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Non-uniform Temperature Distribution Implications on Thermal Analysis Accuracy of Si IGBTs and SiC MOSFETs

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