Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints

Li, Huaicheng; An, Tong; Bie, Xiaorui; Shi, Ge; Qin, Fei

doi:10.1109/icept.2016.7583318

Cited by 7 publications

(1 citation statement)

References 11 publications

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“…Both thermo-mechanical fatigue and thermal ageing pose a significant threat to the long-term reliability of solder interconnects. In order to understand how reliable these interconnects are, metallurgical changes that affect characteristics of solder interconnect, such as bond formation, creep and fatigue behaviour must be fully understood [15][16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Solder joint failures under thermo-mechanical loading conditions – A review

Depiver

Mallik

Harmanto

2020

Advances in Materials and Processing Technologies

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Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device. Under severe thermal and mechanical loadings, solder joints could fail in 'tensile fracture' due to stress overloading, 'fatigue failure' because of the application of cyclical stress and 'creep failure' due to a permanent long-term load. This paper reviews the literature on solder joint failures under thermo-mechanical loading conditions, with a particular emphasis on fatigue and creep failures. Literature reviews mainly focused on commonly used lead-free Sn-Ag-Cu (SAC) solders. Based on literature in experimental and simulation studies on solder joints, it was found that fatigue failures are widely induced by accelerated thermal cycling (ATC). During ATC, the mismatch in coefficients of thermal expansion (CTE) between different elements of electronics assembly contributes significantly to induce thermal stresses on solder joints. The fatigue life of solder joints is predicted based on phenomenological fatigue models that utilise materials properties as inputs. A comparative study of 14 different fatigue life prediction models is presented with their relative advantages, scope and limitations. Creep failures in solder joints, on the other hand, are commonly induced through isothermal ageing. A critical review of various creep models is presented. Many of these strain ratebased creep models are routed to very well-known Anand Model of inelastic strain rate. Finally, the paper outlined the combined effect of creep and fatigue on solder joint failure.

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Section: Introductionmentioning

confidence: 99%

Solder joint failures under thermo-mechanical loading conditions – A review

Depiver

Mallik

Harmanto

2020

Advances in Materials and Processing Technologies

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Effect of filling level and fillet profile on pin-through-hole solder joint

Ishak

Aziz

Ismail

et al. 2019

Int J Adv Manuf Technol

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Temperature and strain-rate dependent constitutive model for prediction of thermal cycling life

Wang

Long

2019

IOP Conf. Ser.: Mater. Sci. Eng.

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With temperature cycling as the characteristic working environment of aerospace electronic chips, various constitutive models have been proposed to predict the failure problems of solder joints. However, most researchers adopted only a set of constant parameters to describe the solder joint material properties throughout the temperature cycles, which is obviously unreasonable concerning the possible wide range of working temperature. In fact, with the changing temperature and strain rate, some material parameters will correspondingly evolve as observed in the experiments. In this paper, the framework of the Anand constitutive model is adopted to verify the effect of material parameters of different temperatures and strain rates on the mechanical properties of materials under the scenario of temperature cycling. The lead-containing solder alloy 63Sn37Pb material that is most widely used in aerospace is selected as the solder material for the interconnection structure. In addition, a typical plastic ball grid array (PBGA) packaging structure is used to analyze the influence of the constitutive model parameters on the PBGA thermal fatigue life. Based on experimental data, seven sets of constitutive model parameters with different temperatures (-55°C~125°C) under a region of low strain rate (1×10-4/s) were employed to compare the mechanical properties of the material under temperature cycling. The sensitivity analysis of material parameters is performed and the underlying mechanism are also explained so that the present study can promote the optimization of the constitutive model in numerical simulations in practice.

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Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints

Cited by 7 publications

References 11 publications

Solder joint failures under thermo-mechanical loading conditions – A review

Solder joint failures under thermo-mechanical loading conditions – A review

Effect of filling level and fillet profile on pin-through-hole solder joint

Temperature and strain-rate dependent constitutive model for prediction of thermal cycling life

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