2019
DOI: 10.1007/s00170-018-03285-7
|View full text |Cite
|
Sign up to set email alerts
|

Effect of filling level and fillet profile on pin-through-hole solder joint

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 30 publications
0
2
0
Order By: Relevance
“…The conservation of momentum in a fluid is described by the Navier-Stokes Equations ( 2)-( 4), where v is the kinematic viscosity, and ρ is the fluid density [30][31][32][33].…”
Section: Mathematical Equationsmentioning
confidence: 99%
See 1 more Smart Citation
“…The conservation of momentum in a fluid is described by the Navier-Stokes Equations ( 2)-( 4), where v is the kinematic viscosity, and ρ is the fluid density [30][31][32][33].…”
Section: Mathematical Equationsmentioning
confidence: 99%
“…The coating material of the heat sink plays a critical role in enhancing the heat sink's performance. Various coating materials, such as carbon materials and SiO 2 [29], cupric oxide (CuO), silicon-based resin [30], carbon nanotube [31], copper-graphene [32], and phase-change materials [33], have been used on the coating of the heat sink surface. The heat sink coating can be achieved using the direct current electrodeposition technique, laser etching, and spraying.…”
Section: Introductionmentioning
confidence: 99%