Advances in Electronic Packaging, Parts A, B, and C 2005
DOI: 10.1115/ipack2005-73243
|View full text |Cite
|
Sign up to set email alerts
|

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Abstract: Over the past few years, the air cooling technology improvements present diminishing returns for microprocessors cooling applications. Presently most of the proposed future cooling technologies (i.e. pumped liquid cooling or vapor compressor refrigeration) may need some fluid moving device and a large remote heat exchanger which requires additional volume. Due to the complexity, reliability issues and space requirements it is preferred to extend the air cooling within the current form factors and using passive… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
9
0

Year Published

2006
2006
2021
2021

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 16 publications
(9 citation statements)
references
References 4 publications
0
9
0
Order By: Relevance
“…These systems are capable of generating a sub-zero effective thermal resistance, and all that is required is that the evaporator, which is attached to the chip package, has a contact temperature less than the cooling air temperature. The result is a substantial increase in heat dissipation from the chip [17], [23].…”
Section: B Current Methods For Ic Coolingmentioning
confidence: 99%
“…These systems are capable of generating a sub-zero effective thermal resistance, and all that is required is that the evaporator, which is attached to the chip package, has a contact temperature less than the cooling air temperature. The result is a substantial increase in heat dissipation from the chip [17], [23].…”
Section: B Current Methods For Ic Coolingmentioning
confidence: 99%
“…This shift is due to increasing power demands that come with technology scaling that cannot be met cost effectively by current cooling and battery technology [13,17]. Thus, tight power budgets on systems have driven the industry to use multiple identical power-efficient cores within a given die area [3,9].…”
Section: Introductionmentioning
confidence: 99%
“…1). Active cooling, despite adding heat to the system being cooled, can result in reduced effective thermal resistances [3][4][5]. A TEC consists of an array of semiconductor pairs of p/n pellets connected electrically in series, and thermally in parallel.…”
Section: Introductionmentioning
confidence: 99%