Thermal characterization of carbon nanotube fiber by time-domain differential Raman

The miniaturization in energy devices and their critical needs for heat dissipation have facilitated research on exceptional thermal properties of novel low-dimensional materials. Current studies demonstrated the main challenge for solving thermal transport issues is the large thermal contact resistance across these low-dimensional material interfaces when they are either bundled together or supported by a substrate. A clear understanding of thermal transport across these atomic interfaces through experimental characterization or numerical simulation is important, but nontrivial. Due to instrumentation limit, only a few thermal characterization methods are applicable. Accordingly, many studies have been conducted by theoretical analysis and molecular dynamics to understand the physical process during this ultra-fast and ultra-small thermal transport. In this review, both experimental work and molecular dynamics studies on atomic-scale thermal contact resistance of low-dimensional materials (from zero-to two-dimensional) are reviewed. Challenges as well as opportunities in the study of thermal transport in atomic-layer structures are outlined. Considering the remarkable complexity of physical/chemical conditions, there is still a large room in understanding fundamentals of energy coupling across these atomic-layer interfaces.

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“…Precedent work includes the successful measurement of thermal diffusivity of silicon cantilever [128,129]. and CNT fiber [130].…”

Section: Challenges Confronted In Current Thermal Characterization Tementioning

confidence: 99%

Energy coupling across low-dimensional contact interfaces at the atomic scale

Yue

Zhang

Xie

et al. 2017

International Journal of Heat and Mass Transfer

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“…a) The apparent conductivity is plotted against the sample length. The labels are: 1) Aliev et al, 2) Jakubinek et al, 3) Wang et al, 4) Behabtu et al, 5) Mayhew and Prakash, 6) Li et al, 7) Qiu et al, 8) Gspann et al, and 9) Qiu et al b) Intertube heat conductance as a function of the total “effective” number of interatomic intertube interactions, obtained in MD simulations and predicted by a mesoscopic model. c) Schematic illustration of the 3ω measurement technique for thermal conductivity.…”

Section: Structure and Fundamental Propertiesmentioning

confidence: 99%

Understanding the Mechanical and Conductive Properties of Carbon Nanotube Fibers for Smart Electronics

et al. 2019

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The development of fiber‐based smart electronics has provoked increasing demand for high‐performance and multifunctional fiber materials. Carbon nanotube (CNT) fibers, the 1D macroassembly of CNTs, have extensively been utilized to construct wearable electronics due to their unique integration of high porosity/surface area, desirable mechanical/physical properties, and extraordinary structural flexibility, as well as their novel corrosion/oxidation resistivity. To take full advantage of CNT fibers, it is essential to understand their mechanical and conductive properties. Herein, the recent progress regarding the intrinsic structure–property relationship of CNT fibers, as well as the strategies of enhancing their mechanical and conductive properties are briefly summarized, providing helpful guidance for scouting ideally structured CNT fibers for specific flexible electronic applications.

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“…3 (a). As the diameter of the CNT interconnect is much lesser than the length, the heat transfer is considered one-dimensional which is along the length [34]. The one-dimensional heat equation of solids applies to nanoscale interconnects [28].…”

Section: Electrical Interconnectmentioning

confidence: 99%

Power Withstanding Capability and Transient Temperature of Carbon Nanotube-Based Nano Electrical Interconnects

Robert¹

2021

ECS J. Solid State Sci. Technol.

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This paper exhibits the electrothermal modelling and evaluation of Carbon Nanotube (CNT) based electrical interconnects for electronic devices. The continuum model of the CNT is considered and the temperature across interconnect is predicted for the given power. Finite element modelling software COMSOL Multiphysics is used to carry out the simulations. The results are compared with Al and Cu interconnects. An electrothermal analysis is also carried out to obtain the temperature for the given power for Single-Walled CNT, Double-Walled CNT, Triple-Walled CNT, and Multi-Walled CNT. Results show that the CNT interconnects performs better when compared to Al and Cu interconnects. The power withstanding capability of CNT is 68.75 times more than Al and 32.35 times more than Cu. Based on the transient analysis, the time taken by the CNT interconnects to reach a steady temperature is obtained as 0.007 ns. On the application of power, Cu and Al interconnects takes 0.1 ns to reach the steady-state temperature. The nanostructured CNT based electrical interconnects would play a considerable role in replacing Cu and Al electrical interconnect applications for micro and nanoelectronic devices.

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Thermal characterization of carbon nanotube fiber by time-domain differential Raman

Cited by 45 publications

References 44 publications

Energy coupling across low-dimensional contact interfaces at the atomic scale

Energy coupling across low-dimensional contact interfaces at the atomic scale

Understanding the Mechanical and Conductive Properties of Carbon Nanotube Fibers for Smart Electronics

Power Withstanding Capability and Transient Temperature of Carbon Nanotube-Based Nano Electrical Interconnects

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