2006 European Microwave Integrated Circuits Conference 2006
DOI: 10.1109/emicc.2006.282705
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Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application

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Cited by 4 publications
(3 citation statements)
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“…Inside the multilayer LTCC matching circuits, DC-and RF-routing as well as passive structures like filters, baluns and multiplexers are implemented [2][3][4][5][6][7]. LTCC has also been proven a viable platform for integration of power amplifiers and other active components with respect to thermal dissipation [8]. Besides purely RF active devices transceiver IC are also integrated to the LTCC module.…”
Section: Motivationmentioning
confidence: 99%
“…Inside the multilayer LTCC matching circuits, DC-and RF-routing as well as passive structures like filters, baluns and multiplexers are implemented [2][3][4][5][6][7]. LTCC has also been proven a viable platform for integration of power amplifiers and other active components with respect to thermal dissipation [8]. Besides purely RF active devices transceiver IC are also integrated to the LTCC module.…”
Section: Motivationmentioning
confidence: 99%
“…It has enabled techniques for RF and microwave electronic systems, by hybrid-integrating passive structures with active components in a single module [6].…”
Section: Introductionmentioning
confidence: 99%
“…Inside the LTCC matching circuits, DC-routing as well as passive structures like filters, baluns and multiplexers can be implemented [4], [5]. LTCC has also been proven a viable platform for integration of power amplifiers and other active components with respect to thermal dissipation [6]. These active components are mounted on top of the LTCC and connected to the passive functions inside the module per wire-bond, flip chip and surface mount technology or combinations thereof.…”
Section: Introductionmentioning
confidence: 99%