Thermal and mechanical analysis of high-power GaAs flip-chips on CVD diamond substrates

Brown, Melissa; Singh, Sushila; Malshe, Ajay P.; Gordon, Mollie; Schmidt, W.; Brown, W.D.

doi:10.1016/s0925-9635(99)00162-4

Cited by 5 publications

(1 citation statement)

References 7 publications

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“…They have considered the geometry of the flip-chip package and the thermal events including the phase transition of the solder material and exothermic underfill curing reaction. Brown et al (1999) evaluated structural and thermal performance of a large, 10 £ 10 mm, GaAs die, flip-chip attached to 25.4 £ 25.4 mm diamond substrate using numerical, analytical and experimental methods. They have calculated stresses induced in die using temperature dependent, bi-linear solder plasticity properties.…”

Section: Introductionmentioning

confidence: 99%

Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process

Addagarla

Prasad

2012

Soldering &Amp; Surface Mount Technology

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Purpose -Out-of-plane displacement (warpage) is one of the major thermomechanical reliability concerns for board-level electronic packaging. The warpage and residual stresses can cause unreliability in the performance of electronic chip. An accurate estimation of the distortion and the residual stresses will help in selecting right combination of material for soldering and to determine the better assembly procedure of the chip. The purpose of this paper is to create a 3D nonlinear finite element model to predict the warpage, bending stresses, shear and peel stresses in a flip-chip on board (FCOB). Design/methodology/approach -A 3D finite element procedure has been developed considering the material nonlinearity during solidification for a FCOB assembly. Finite element results have been compared with the experimental values. Findings -The present finite element method gives better approximation of residual warpage and stresses compared to analytical models available in the literature. Originality/value -The 3D finite element approach considering the elasto-plastic and temperature-dependent material properties has not been attempted by any authors. Experiments have been conducted for the comparison of finite element values. The finite element results compare better than the methods available in the literature. Hence a better method for estimating the deformation and residual stresses in flip-chip assembly has been suggested.

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Section: Introductionmentioning

confidence: 99%

Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process

Addagarla

Prasad

2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

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Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model

Yeh

2016

Microelectronics Reliability

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Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages

Fabis¹

1999

Microelectronics Reliability

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Thermal and mechanical analysis of high-power GaAs flip-chips on CVD diamond substrates

Cited by 5 publications

References 7 publications

Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process

Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process

Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model

Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages

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