.Microelectromechanical Systems (hlEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended fimction, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific. requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of ftmctional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.
The method of optical waveguide fabrication by ion-exchange has various advantages such as low loss, ease of fabrication, low material cost etc. In the present paper,a package developed for the simulation of ion-exchange process has been discussed. This simulator helps in simulating the required profile and consequent mode structure by manipulating the fabrication parameters. The complete package has been written with user orientation. . INTRODUCTIONThe trend towards faster devices has resulted in the devalopement of optoeleetronic devices. A major component of any optoelectronic device is the waveguide used in the optoelectronic system. Several means of fabricating waveguides exist. But perhaps one of the simplest, and the cheapest, is to fabricate iaveguides by silver-sodium ion exchange in glass.Although the fabrication and caracterisation of such waveguides has been widely reported 2 , literature survey reveals that no attempt has been made to develop a simulator for passive optical integrated devices. The present paper attempts to bridge this gap between the theoritical and actual results. It is well known that making passive integrated optical devices depend greatly on our ability to control their properties by adjusting the fabrication parameters. If the parameter values can be optimised by test runs of the simulator , then the desired quality of devices may be obtained. .MODEL DESCRIPTJONThe model 4sed in this simulator is the one proposed by Stewart et 1 since it reported t have been confirmed independently by Griffiths and Khan". The refractive index profile model for the ion-exchanged waveguides is a second order polynomial of the form n(?)where n(>) is the refractive index at a depth of micrometers from the surface, n5 is the refractive index at the surface of the glass, n is the maximum difference in the refractive index, i.e. An = (n5 -n1), and n1 is the refractive index of the substrate glass; b determines the shape of the profile and d is scaling factor for depth. Whn n() = n1, Eq(1) becomes [b(:,/d) + (ç/d) 1 (2) 404/ Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/22/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx
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