Thermal and electrical behaviour of some hybrid polyimide films containing barium and titanium oxides

Hamciuc, Corneliu; Hamciuc, Elena; Olariu, Marius; Ciobanu, Romeo Cristian

doi:10.1002/pi.2747

Cited by 23 publications

(14 citation statements)

References 25 publications

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“…Typically, three relaxation processes are observed with increasing temperature designated as c, b, and a, respectively, with a corresponding to the glass-rubber relaxation. There are some reports, which refer to the characterization and analysis of the electrical and dynamical properties of polyimide hybrid films [36][37][38][39][40][41][42][43][44]. The properties of these materials are dependent on the interphase between filler and the polymer matrix.…”

Section: Introductionmentioning

confidence: 97%

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Hamciuc¹,

Hamciuc²,

Okrasa

et al. 2012

J Mater Sci

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Zeolite L, with the ratio Si/Al = 4, was prepared by hydrothermal method and used to obtain composite films based on a polyimide matrix having pendant carboxylic groups. The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films was studied. The films were prepared by casting a suspension resulting from direct mixing of a poly(amic acid) (PAA) solution and zeolite L particles onto glass plates, followed by thermal imidization under controlled temperature conditions. The PAA was synthesized by solution polycondensation of a mixture of two diamines, 3,5-diaminobenzoic acid and 2,2-bis[4-(4-aminophenoxy)phenyl]propane (molar ratio 1:3), with 4,4 0 -oxydiphthalic anhydride, using N-methyl-2-pyrrolidone as solvent. To improve the compatibility between organic and inorganic phases, the surface of zeolite particles was modified by treating with 3-aminopropyltriethoxysilane. The surface morphology of the composite films investigated by scanning electron microscopy showed good compatibility between filler and polymer matrix. The films were flexible, tough, and exhibited high-thermal stability, having the initial decomposition temperature above 450°C. Dynamic mechanical analysis and dielectric spectroscopy revealed sub-glass transitions, c and b, and an a relaxation corresponding to the segmental motions above the glass transition temperature. The values of the dielectric constant at 10 kHz and 200°C were in the range of 3.3-4.2.

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Section: Introductionmentioning

confidence: 97%

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Hamciuc¹,

Hamciuc²,

Okrasa

et al. 2012

J Mater Sci

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“…The concept of cooperativity is related to the ease with which polymer chains move at T g . If the molecular chains in a polymer resist movement at T g , then the tan δ peak will be broad …”

Section: Resultsmentioning

confidence: 99%

Synthesis and characterization of organosoluble radiation‐resistant composite materials from octa(maleimidophenyl)silsesquioxane and aryldiamines

Nagendiran

Dinakaran

Chandramohan³

et al. 2018

Polymers for Advanced Techs

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Radiation‐resistant composite materials based on nano‐sized polyhedral oligomeric silsesquioxanes building blocks. We successfully synthesized via aspartimide linkages resulting from Michael addition of octa(maleimidophenyl)silsesquioxane (OMIPS) and aryldiamines OMIPS. These materials can serve as a nano building block for construction of materials with nanometer control of the periodicity of the organic and inorganic components. The monomer concentration and reaction time of polymerization are optimized, which were 0.047 mol L−1 and 96 hours, respectively. The resulting polyaspartimides (PPAIs) were characterized by Fourier transform infrared, dielectric analysis, thermal properties, and morphological studies. The PPAI polymers are amorphous and soluble in highly polar organic solvents and show glass transition temperatures of 297°C to 323°C. They offer good thermal stability of 437°C to 507°C under nitrogen atmosphere, high char yields of 58% to 65% at 800°C, and have a dielectric constant of 3.7 to 4.1. Transition electron microscope analysis reveals the OMIPS dispersed well in molecular level in the continuous matrix while some aggregates also seen in the matrix. The UV radiation resistance of the resulting PPAI polymers was investigated.

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“…26 There are some reports, which refer to the characterization and analysis of the electrical and dynamical properties of polyimide hybrid films. [27][28][29][30][31] The properties of these materials are dependent on the interphase between filler and the polymer matrix. Polymer filler interactions could produced change in α, β, and γ transitions of the polymer matrix since the amplitude of the relaxation depends on the chain flexibility of the molecules.…”

Section: Introductionmentioning

confidence: 99%

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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Hybrid films containing silica were prepared using a poly(amic acid) incorporating polydimethylsiloxane segments and tetraethoxysilane via a sol-gel technique and thermal cyclodehydration. The surface morphology of the films was examined by atomic force microscopy and scanning electron microscopy. The free surface energy was evaluated based on contact angle measurements. The films were flexible and showed good mechanical properties. They exhibited high thermal stability with an initial decomposition temperature above 420 o C and a glass transition temperature in the range of 216-223 o C. Dielectric spectroscopy revealed primary α 1 relaxation due to the polydimethylsiloxane segments, and three subglass transitions: γ, β 1 and β 2 . At higher temperatures, α 2 -relaxation that corresponds to the upper glass transition and a conductivity process appeared. The influence of the silica content on the hybrid film properties was examined. Dynamic mechanical analysis revealed similar relaxation processes to those observed by dielectric spectroscopy.

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Thermal and electrical behaviour of some hybrid polyimide films containing barium and titanium oxides

Cited by 23 publications

References 25 publications

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Synthesis and characterization of organosoluble radiation‐resistant composite materials from octa(maleimidophenyl)silsesquioxane and aryldiamines

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

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