“…The spectrum which describes the G-R conuibution, in the case of a single time constant, can be expressed as equivalent noise voltage at the input [5] and depends on the time constant of the emission process q as…”
Thc analog performance of the Thomson HSOI3-HD tcchnology has becn mcasurcd up to a total dose of 12 Mrad(Si) of ionizing radiation (60Co). The thrcshold voltage shift is -170 m V for p-channel and -20 m V for n-channel transistors. Transconductancc degradation is respectively 4% and 17%. Noise has been mcasurcd in thc 500 Hz-25 MHz bandwidth. In addition to thc I/f and whitc noise, a gencration-rccombination contribution appears in thc noisc spectrum. This contribution is scnsitivc to the bias applied to the backgatc and body electrodes. Thc whitc noisc incrcasc aftcr irradiation is 16% for p-channel and 35% for nchanncl transistors. p-channel transistors havc vcry low 1/f noise and arc less sensitive to irradiation effccts.
“…The spectrum which describes the G-R conuibution, in the case of a single time constant, can be expressed as equivalent noise voltage at the input [5] and depends on the time constant of the emission process q as…”
Thc analog performance of the Thomson HSOI3-HD tcchnology has becn mcasurcd up to a total dose of 12 Mrad(Si) of ionizing radiation (60Co). The thrcshold voltage shift is -170 m V for p-channel and -20 m V for n-channel transistors. Transconductancc degradation is respectively 4% and 17%. Noise has been mcasurcd in thc 500 Hz-25 MHz bandwidth. In addition to thc I/f and whitc noise, a gencration-rccombination contribution appears in thc noisc spectrum. This contribution is scnsitivc to the bias applied to the backgatc and body electrodes. Thc whitc noisc incrcasc aftcr irradiation is 16% for p-channel and 35% for nchanncl transistors. p-channel transistors havc vcry low 1/f noise and arc less sensitive to irradiation effccts.
“…The difference between the predicted value of B = 1/3 [12,13] and the experimental value (less than 1/3) could be related to the fact that the theoretical B coefficient was determined for conventional planar devices with one gate, and the investigated devices are multiple-gate 3D devices. For these reasons, even if the traps in the Si film are related to a volume phenomenon, we determined the surface (effective) density of the identified traps, for which no assumptions on the value of the B coefficient and on the value of the depletion zone of the Si film are necessary.…”
, et al.. Identification of Si film traps in p-channel SOI FinFETs using low temperature noise spectroscopy. Solid-State Electronics, Elsevier, 2015, 112, pp
“…The last term in Eq. (1) is related to generation-recombination (G-R) noise sources characterized by Lorentzian spectra and corresponding to the presence of recombination centers located either in oxides or sourcedrain junctions reacting as generation-recombination sites or traps for carriers [13]. A, B and C i are fitting parameters and f ci corresponds to the corner noise frequency associated to the ith G-R noise source.…”
Section: Noise Signatures Of Cdm Induced Defectsmentioning
In this paper, it is demonstrated that low frequency noise measurements are an efficient tool for the detection of latent defects induced by CDM stress in a complex circuit such as a DC-DC converter. This technique is able to detect the presence of a defect whereas classical electrical testing techniques such as Iddq or functionality test fail. In addition, a correlation between the noise signature and the nature of the defect is established. In particular, the presence of trapped charges in the oxides is clearly identified.
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