1986
DOI: 10.1116/1.573673
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The role of hard coatings in carbide milling tools

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Cited by 38 publications
(4 citation statements)
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“…Titanium nitride (TiN) hard coating deposited by sputtering has brought about one of the most significant technological advances in the development of modern tools. In the early years of PVD hard coating, TiN was essentially the only coating developed until 1980 [32]. Although many other PVD hard coatings were later developed, TiN coating remains one of the most important since it is a simple coating system, is easily to produce, and can be reused.…”
Section: Introductionmentioning
confidence: 99%
“…Titanium nitride (TiN) hard coating deposited by sputtering has brought about one of the most significant technological advances in the development of modern tools. In the early years of PVD hard coating, TiN was essentially the only coating developed until 1980 [32]. Although many other PVD hard coatings were later developed, TiN coating remains one of the most important since it is a simple coating system, is easily to produce, and can be reused.…”
Section: Introductionmentioning
confidence: 99%
“…The first PVD coating is developed in 1980 (Titanium based coatings) for HSS drill and carbide inserts [57]. Moreover, multilayer coatings also prepared such as Titanium, Aluminum and Chromium.…”
Section: Physical Vapour Deposition Techniques and Its Classificationmentioning
confidence: 99%
“…1-3 It is formed by using PVD at a lowest temperature of 280°C or by using CVD, but at much higher temperatures such as 1000°C. [3][4][5] It can be deposited also by using reactive MS. 6 Crystalline Al 2 O 3 , frequently deposited, has different forms, namely j-, d-, h-and c-phase. 3,7,8 These phases are metastable, being formed using CVD as well as PVD coating techniques.…”
mentioning
confidence: 99%
“…However, the high temperature needed for the deposition will cause changes of substrate material properties and coarser grain sizes. 4 Accordingly, a great emphasis over the last ten years has been directed toward developing PVD, in which crystalline films can be deposited at T s lower than 500°C. [1][2][3]6,9,[11][12][13][14] In a recent work, 9 it has been reported that by PVD-pulsed MS, c-Al 2 O 3 was deposited at T s even as low as 290°C.…”
mentioning
confidence: 99%