The reliability of reflow soldering by hot air reflow

Kojima, Yoshinori; Kikuchi, Mio; Matsunaga, Kentaro; Yamazaki, Noriyuki

doi:10.1109/emts.1989.68950

Cited by 3 publications

(1 citation statement)

References 3 publications

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“…3(b). In Kojima et al [10], the distance between the chip carrier and the PCB [h1 in Fig. 3(b)] was adopted as the solder height, regardless of the solder shape.…”

Section: A Regression For Engelmaier Model Constantsmentioning

confidence: 99%

Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean

Chai

Osterman

Pecht

2014

IEEE Trans. Device Mater. Relib.

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To investigate modeling approaches for predicting solder interconnect fatigue life under field thermal conditions, a complex temperature cycle composed of three temperature dwell points was modeled and physically tested. Modeling the solder interconnect life expectancy under these complex conditions is accomplished by segmenting the complex temperature cycle into multiple simple temperature cycles, predicting the life expectancy of the solder interconnect under the simple temperature cycles using the Engelmaier model, and applying Miner's rule to superpose the damage of the segmented cycles and predict solder interconnect fatigue life under the complex temperature cycle. Several modeling strategies based on different segmenting schemes are presented, and the one with the best comparison with the physical test results is identified. A case study is presented for ceramic leadless chip carriers assembled with Sn62Pb36Ag2, Sn96.5Ag3Cu0.5, and SN100C solders. The Engelmaier model constants to model the simple temperature cycles are also provided as a basis for modeling the complex cycle.Index Terms-CLCC, Complex temperature cycling, Engelmaier model, life prediction, linear damage superposition, reliability, vary amplitude and mean.

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“…3(b). In Kojima et al [10], the distance between the chip carrier and the PCB [h1 in Fig. 3(b)] was adopted as the solder height, regardless of the solder shape.…”

Section: A Regression For Engelmaier Model Constantsmentioning

confidence: 99%

Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean

Chai

Osterman

Pecht

2014

IEEE Trans. Device Mater. Relib.

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The reliability of reflow soldering by hot air reflow

Kojima

Kikuchi

Matsunaga

et al.

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium

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a n d K a t s u k i M a t s u n a g a a n d N a o y a Y a m a z a k i F U J I T S U L t d 2 0 2 5 K a m i k o d a n a k a N a k a h a r a --k u . K a w a s a k iSurface Mounting Technology presents a very rapid growth and its product must be careful controlled. In SMT, the reliability of solder joint on FR-4 substrate by hot air reflow Soldering was investigated.This reflow soldering is used b y circulated hot air in the reflow chamber, and the feature i s that heat mass is big and stable, and the ability is similar to vapor phase reflow.By hot air reflow soldering, the temperature-rise

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Utilization of sensory feedback during SMT assembly

Brown

Martin-Vega

Shaw

et al. 1994

Conference Record Southcon

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This paper investigates the insertion of inline sensors into Surface Mount Technology (SMT) production lines for the purpose of improving yield and reducing production costs by elevating the quality level of the product to the six sigma level. Each process step in the assembly process, starting with board loading, through deposition, part placement, and reflow will be discussed for monitoring in real time for deviations. When deviations are detected, feedback can be sent either to operators or the equipment for corrective action thus providing a closed loop SMT assembly process.

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The reliability of reflow soldering by hot air reflow

Cited by 3 publications

References 3 publications

Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean

Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean

The reliability of reflow soldering by hot air reflow

Utilization of sensory feedback during SMT assembly

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