The reliability of (AlxGa1?x)0.5In0.5P visible light-emitting diodes

Lacey, J. D. G.; Morgan, D. V.; Aliyu, Y.H.; Thomas, H.

doi:10.1002/(sici)1099-1638(200001/02)16:1<45::aid-qre302>3.0.co;2-q

Cited by 14 publications

(3 citation statements)

References 8 publications

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“…This changes occurs in the generation-recombination current region as its has been reported [13,15,16]. We have done some complementary tests at 150°C and four different current intensities, and chip degradation is observed specially at higher current intensity, 30 mA and 40 mA.…”

Section: Degradation Failuressupporting

confidence: 61%

Evaluation of AlGaInP LEDs reliability based on accelerated tests

Nogueira

Vázquez

Núñez

2009

Microelectronics Reliability

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Section: Degradation Failuressupporting

confidence: 61%

Evaluation of AlGaInP LEDs reliability based on accelerated tests

Nogueira

Vázquez

Núñez

2009

Microelectronics Reliability

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“…This current concentration may be the main reason of the ITO degradation. Traditionally, along with time, the LED light output power decreases exponentially [7] . From the above experiments, the voltage failure happens be-fore the light drop becomes evident.…”

Section: Discussionmentioning

confidence: 99%

Reliability of AlGaInP light emitting diodes with an ITO current spreading layer

et al. 2009

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Three aging experiments were performed for AlGaInP light emitting diodes (LED) with or without indium tin oxide (ITO), which is used as a current spreading layer. It was found that the voltage of the LED with an ITO film increased at a high current stressing, while there was little change for that of the LED without the ITO. The results of the LEDs with different thicknesses of the ITO film show that the LED with a thicker ITO has a higher reliability. The main reason for the voltage increase of the LED with the ITO film might be the current crowding in the ITO film around the P-type electrode.

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“…If heat from the LED is not efficiently released to the outside, the piled heat lets the life of the device decrease rapidly (2)(3) . In addition, heat generated from the junction of the LED causes the physical damgages of LED packages such as pad crack, delamination, misalignment (4)(5) . In this study, it was identified by applying thermal vias in LED packages what sizes and pitches of thermal vias was optimum to dissipate the heat from LED packages.…”

Section: Introductionmentioning

confidence: 99%

Thermal Resistivity Properties of LED Packages with Thermal via

Lee

Shin

Jung

2010

AMR

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The LED chips, packages and related materials have been already key issue on electronic applications and substitution of conventional lights. It is easily expected that the development trend of LED products is nearly the same as that of electronic products with higher performance, higher integration, lower energy and lower cost. And then we also prospect that the dissipated heat from LED chip is to be big problem for a reliability of products, as likely that electronic packages contain heat sink or heat spreader for controlling heat dissipation. In fact, the heat from an LED package with 1~3W LED chip shows a nearly 60~150°C, which affects thermal damage related to performance, joint failure, crack, etc. The thermal via was fabricated with 16 segments of via sizes ranged 0.2~1.2mm and via pitches ranged 0.5~3mm using 1~3W LED, respectively. The thermal resistivity was analyzed by the thermal transient tester with the variation of via sizes and pitches, which was also compared with the temperature difference of the top and bottom side of LED package. As a results, we convincingly proved the relationships between the design of thermal via and the heat dissipation of LED module, which were directly applicable to LED industry.

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The reliability of (AlxGa1?x)0.5In0.5P visible light-emitting diodes

Cited by 14 publications

References 8 publications

Evaluation of AlGaInP LEDs reliability based on accelerated tests

Evaluation of AlGaInP LEDs reliability based on accelerated tests

Reliability of AlGaInP light emitting diodes with an ITO current spreading layer

Thermal Resistivity Properties of LED Packages with Thermal via

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