2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2010
DOI: 10.1109/icept.2010.5582722
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The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package

Graver Chang
1
,
Chi-Ko Yu
2
,
Tina Shao
3
et al.
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The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging

Hau-Riege
1
,
Keser
2
,
Alvarado
3
et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
8
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1
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The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging

Hau-Riege
1
,
Keser
2
,
Alvarado
3
et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
8
0
1
0
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Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Yongsheng
1
,
Hsiao
2
,
Lin
3
2014
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
1
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Experimentally validated analysis and parametric optimization of monotonic 4-point bend testing of advanced BGA packages

Wang
1
,
Xie
2
,
Ahmad
3
2012
2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging
3
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