2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) 2014
DOI: 10.1109/eptc.2014.7028311
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Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Zou Yongsheng
1
,
Yu-Hsiang Hsiao
2
,
Kwang‐Lung Lin
3
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