Beyond-Cmos Technologies for Next Generation Computer Design 2018
DOI: 10.1007/978-3-319-90385-9_5
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The Processing-in-Memory Paradigm: Mechanisms to Enable Adoption

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Cited by 21 publications
(19 citation statements)
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“…These proposals are known as computational RAM, intelligent RAM, processing in memory chips, intelligent memory systems, [22] - [31], etc. These merged memory/logic chips implement on-chip memory which allows high internal bandwidth, low latency, and high power efficiency, eliminating the need for expensive, high-speed inter-chip interconnects, [35]. This makes them suitable to perform computations which require high data throughput and stride memory accesses, such as FFT, multimedia processing, network processing, etc., [28].…”
Section: Current Statementioning
confidence: 99%
“…These proposals are known as computational RAM, intelligent RAM, processing in memory chips, intelligent memory systems, [22] - [31], etc. These merged memory/logic chips implement on-chip memory which allows high internal bandwidth, low latency, and high power efficiency, eliminating the need for expensive, high-speed inter-chip interconnects, [35]. This makes them suitable to perform computations which require high data throughput and stride memory accesses, such as FFT, multimedia processing, network processing, etc., [28].…”
Section: Current Statementioning
confidence: 99%
“…In this paper, we explore two new approaches to enabling PIM in modern systems. The first approach only minimally changes memory chips to perform simple yet powerful common operations that the chip is inherently efficient at performing [12,13,15,22,23,60,73,[87][88][89][90][91][92][93]. Such solutions take advantage of the existing memory design to perform bulk operations (i.e., operations on an entire row of DRAM cells), such as bulk copy, data initialization, and bitwise operations [13,[88][89][90][91].…”
Section: Introductionmentioning
confidence: 99%
“…Even though the idea seems as simple, this combination requires special fabrication in-chip manufacturing. The architecture targets to combine the processor logic with a stack of through-silicon-via (TSV) bonded memory die [6,7]. The logical core of the memory system is a kind of single instruction multiple data (SIMD) processor where the different memory portions are directly connected to different cores, thus increasing the overall system bandwidth.…”
Section: Introductionmentioning
confidence: 99%