The performance improvement of aramid insulation paper by nano-SiO2 modification

Tang, Chao; Xu, Li Li; Yin, Fei; Hao, Jian

doi:10.1109/tdei.2017.006560

Cited by 49 publications

(22 citation statements)

References 27 publications

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“…Dielectric properties, mechanical properties, and thermal behavior are the crucial properties of insulating paper. [ 29–31 ] According to literature, cellulosic paper treated with BTCA crosslinking presented enhanced mechanical properties. [ 32,33 ] BTCA crosslinking could consume hydroxyl groups and change the molecular structure and composition of cellulose, thereby reducing its polarizability.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Cellulose Insulating Paper with Low Dielectric Constant by BTCA Esterification Crosslinking

Yang

Hou

et al. 2020

Macro Materials & Eng

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This study aims to decrease the dielectric constant of kraft paper by 1,2,3,4‐butanetetracarboxylic acid (BTCA) esterification crosslinking. Kraft paper samples are treated with various concentrations of BTCA to prepare modified paper with different reaction degrees. Morphology and surface chemical composition are characterized. The dielectric constant and loss of the plain and modified paper are also investigated. Results show that esterification occurs successfully between cellulose molecular chain and BTCA. The intrinsic dielectric constant and loss of 6 g L−1 BTCA‐treated paper decrease by 23.5% and 36.3%, respectively, at 50 Hz. The esterification can reduce the hydroxyl amounts on cellulose. The formed crosslinking network between the cellulose chains restricts the cellulose orientation polarization, thereby reducing cellulose polarizability. The electrical strength, mechanical properties, and thermal behavior of the samples are explored to evaluate comprehensively the modifying effect. BTCA esterification crosslinking proves to be a promising method for decreasing the dielectric constant of kraft paper.

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Section: Introductionmentioning

confidence: 99%

Preparation of Cellulose Insulating Paper with Low Dielectric Constant by BTCA Esterification Crosslinking

Yang

Hou

et al. 2020

Macro Materials & Eng

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“…In the simulation process, the Andersen thermostat [13] and Barendsen barostat [14] are used to maintain constant temperature and pressure, while the Atom Based approach is used to calculate Van der Waals forces. For other parameters, please refer to the literature [10].…”

Section: Simulation Methods and Parameter Settingsmentioning

confidence: 99%

“…[6] Researches on aramid insulation paper gradually mount up [7,8]. Literatures [9,10] are such studies based on molecular simulation. As force field is the basis of molecular dynamic simulation, force field selection determines how accurate the simulation result will be [11,12].…”

Section: Introductionmentioning

confidence: 99%

Comparison of COMPASS and PCFF in Calculating Mechanical Behaviors of Aramid Fiber by Means of Molecular Dynamics

Wang¹,

Tang²,

Li³

et al. 2017

MMC_B

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In order to compare COMPASS and PCFF in calculating the micro mechanical behaviors of aramid fiber, the molecular dynamic method was employed to establish the COMPASS-based and PCFF-based PMLA models in Materials Studio (MS) software. There were 10 models in each force field, all of which underwent structural optimization and relaxation processing. After every model reached the state of energy minimization, the molecular dynamics simulation was carried out. The simulation results demonstrate that compared to PCFF, COMPASS is less erroneous, more reliable and with more uniform results in calculating the mechanical behaviors of aramid fiber by means of molecular dynamics.

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“…The results indicated that the presence of a fibre surface coating or mild chlorosulphonic acid treatment promotes an increase in the interaction between the fibre and the oxidised multiwall carbon nanotubes. Tang et al [5] conducted molecular dynamics (MD) simulations and experiments to study the influence of SiO 2 nanoparticles on the properties of PMIA. They proposed that a strong interfacial effect existed between nano-SiO 2 and PMIA, and this effect was mainly reflected in the induction force and hydrogen bonding.…”

Section: Introductionmentioning

confidence: 99%

Thermal stability of polyphenylsilsesquioxane‐modified meta‐aramid insulation paper

2020

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The development of new materials for use in advanced distribution transformers is required to improve their heat resistance rating, operational safety, and reliability. The combination of polymer and nanoparticles is the preferred approach to improve the thermal stability of materials. In this study, the thermal stability of laboratory-prepared meta-aramid insulation paper modified with polyphenylsilsesquioxane (PPSQ) was evaluated. The results showed that the thermal stability of the modified insulation paper was superior to that of the unmodified paper. Molecular dynamics simulations were used to analyse the internal mechanism of the performance improvement achieved by modification with PPSQ. From a microscopic perspective, the addition of PPSQ provided a relatively larger structural space for the meta-aramid fibre and increased the free volume of the entire system, which tightened the meta-aramid fibre molecular chains, increased the density of the structure of the paper, and enhanced the mutual permeability between meta-aramid fibre chains. Therefore, the stress can be better transmitted, the performance loss such as phase delamination was effectively prevented, and the bonding between the meta-aramid fibres was strengthened.

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The performance improvement of aramid insulation paper by nano-SiO2 modification

Cited by 49 publications

References 27 publications

Preparation of Cellulose Insulating Paper with Low Dielectric Constant by BTCA Esterification Crosslinking

Preparation of Cellulose Insulating Paper with Low Dielectric Constant by BTCA Esterification Crosslinking

Comparison of COMPASS and PCFF in Calculating Mechanical Behaviors of Aramid Fiber by Means of Molecular Dynamics

Thermal stability of polyphenylsilsesquioxane‐modified meta‐aramid insulation paper

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