The influence of titanium adhesion layer oxygen stoichiometry on thermal boundary conductance at gold contacts

Olson, David H.; Freedy, Keren M.; McDonnell, Stephen; Hopkins, Patrick E.

doi:10.1063/1.5022371

Cited by 23 publications

(21 citation statements)

References 46 publications

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“…The best fit for κ PMMA and G for the three different systems are summarized in the Table 2 The G values are within the same order of magnitude as experimental and theoretical values reported by others [8,20,33,34]. The ATPS sample sees a near doubling in G. The increase in G is in agreement with recent work where TiO x with near-zero oxygen content acted as thermal management at Au/non-metal interfaces [35]. Duda et al reported that the thermal boundary conductance at Au/Si interface was enhanced by a factor of four by inclusion of a Ti adhesion layer and removal of the native oxide [10].…”

Section: Resultssupporting

confidence: 87%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

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In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems.

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Section: Resultssupporting

confidence: 87%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

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“…For Au/Ti/Gr/SiO 2 without any surface functionalization, an intrinsic h K ≈33 MW m −2 K −1 has been measured that is four times smaller than that of the Au/Ti/SiO 2 interface . Recent studies have also shown that h K measured across Au/Ti/Gr/SiO 2 and Au/TiO x /substrate interfaces are not only impacted by the weak interfacial bonding, but are also significantly impacted by the oxide compositions at the Ti contacts that are highly dependent on the Ti deposition rate and base pressure …”

Section: Effect Of Nanostructuring and Surface Functionalizationmentioning

confidence: 99%

“…[161] Recent studies have also shown that h K measured across Au/Ti/Gr/SiO 2 and Au/TiO x /substrate interfaces are not only impacted by the weak interfacial bonding, but are also significantly impacted by the oxide compositions at the Ti contacts that are highly dependent on the Ti deposition rate and base pressure. [162,163]…”

Section: Effect Of Nanostructuring and Surface Functionalizationmentioning

confidence: 99%

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

Giri

Hopkins

2019

Adv Funct Materials

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208

152

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Interfacial thermal resistance is the primary impediment to heat flow in materials and devices as characteristic lengths become comparable to the mean‐free paths of the energy carriers. This thermal boundary conductance across solid interfaces at the nanoscale can affect a plethora of applications. The recent experimental and computational advances that have led to significant atomistic insights into the nanoscopic thermal transport mechanisms at interfaces between various types of materials are summarized. The authors focus on discussions of works that have pushed the limits to interfacial heat transfer and drastically increased the understanding of thermal boundary conductance on the atomic and nanometer scales near solid/solid interfaces. Specifically, the role of localized interfacial modes on the energy conversion processes occurring at interfaces is emphasized in this review. The authors also focus on experiments and computational works that have challenged the traditionally used phonon gas models in interpreting the physical mechanisms driving interfacial energy transport. Finally, the authors discuss the future directions and avenues of research that can further the knowledge of heat transfer across systems with broken symmetries.

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“…While there are pre-existing measurements on the effect of different metal compositions on G, [8][9][10] the outstanding research questions that this work addresses are how temperature treatment affects the interdiffusion of metal bilayer films on dielectric substrates, and how this interdiffusion affects G. Our experiments focus on interdiffusion of the Au-Cu adhesion layer system, and are compared to several published studies [11][12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Impact of metal adhesion layer diffusion on thermal interface conductance

Saha

Jeong

et al. 2019

Phys. Rev. B

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The first systematic measurements on the impact of interdiffusion between a metal overlayer and adhesion layer on the thermal interface conductance (G) at the metal bilayerdielectric interface are reported. Composition depth profiles quantify the interdiffusion of a Au-Cu bilayer as a function of Cu adhesion layer thickness (0-10 nm), annealing time, and annealing temperature. Optical pump/probe measurements of G quantify the effect of Au-Cu interdiffusion on thermal transport across the (Au-Cu)-Al 2 O 3 interface. The enhancement of G between Au and Al 2 O 3 through the addition of a Cu adhesion layer decreases as Au-Cu interdiffusion occurs. For example, annealing a 41 nm Au film with a 4.7 nm Cu adhesion layer on Al 2 O 3 at 520 K for 30 minutes, results in a 52 ±16% drop in G. An analytical model of the composition profile is derived with inputs of annealing time, temperature dependent permeabilities of the Au-Cu interface to each species, and the initial thicknesses of the Au and Cu layers. Integrating this model with a Diffuse Mismatch Model defines a new methodology for the prediction of G that accounts for interdiffusion in metal bilayers on dielectric substrates, and can be used to evaluate the degradation of G over a device's lifetime.

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The influence of titanium adhesion layer oxygen stoichiometry on thermal boundary conductance at gold contacts

Cited by 23 publications

References 46 publications

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

Impact of metal adhesion layer diffusion on thermal interface conductance

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