Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Abstract

In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems.

Thermal properties of metal-halide perovskites

“…In order to guarantee an optimized heat flux, an enhancement of the thermal boundary conductance of such a system has recently been demonstrated by nm sized additional adhesion layers, either titanium or nickel. 208 In this context it should likewise be mentioned that very thin layers can be considered as thermally transparent depending on their mean-free phonon and electron path lengths. 112,113 This means that additional thin functional layers that do not impair the heat flow can be used in the design of metal-halide devices.…”

Optomechanical Processing of Silver Colloids: New Generation of Nanoparticle–Polymer Composites with Bactericidal Effect

“…Despite great differences between these values, they enable one to estimate the order of magnitude for the interfacial conductance. [59] To estimate temperature elevation in the vicinity of NP, the heat equation was solved using the FEM, implemented in FlexPDE [49]. The laser pulse shape was approximated by a rectangle.…”

Discovery of Lead‐Free Perovskites for High‐Performance Solar Cells via Machine Learning: Ultrabroadband Absorption, Low Radiative Combination, and Enhanced Thermal Conductivities

“…[ 21,22 ] The general solutions to thermal issue in device are to dissipate accumulated heat efficiently by adding heat‐dissipation layers, while the complexity of device fabrication process increases. [ 23,24 ] Generally, in materials, Debye temperature $$\theta _D \propto n(\frac{\rho }{M})^{1/3}v_{m}$$, in which n , ρ, M , and v m are the number of atoms per formula unit, the crystal structure's density, molar mass, and average sound velocity, respectively, plays a key role in proxy for structure rigidity and directly relates to the thermal conductivity. If perovskite material possesses a high Debye temperature, generally leading to high thermal conductivity, which is beneficial to rapidly dissipate heat and conducive to the thermal stability of devices.…”