2010
DOI: 10.1016/j.jcrysgro.2010.03.032
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The influence of the Al pre-deposition on the properties of AlN buffer layer and GaN layer grown on Si (111) substrate

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Cited by 22 publications
(13 citation statements)
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“…The root mean square roughness (RMS) value for 0 sec, 30 sec, 60 sec and 90 sec TMAl preflow were 3.42 nm, 3.09 nm, 4.48 and 6.28 nm. The non-linear relation of TMAl preflow and surface roughness was in agreement to those reported by Jianxing Cao et al [6]. It was observed, the surface of AlN with 0 sec TMAl preflow covered by small grain and small pits.…”
Section: A Surface Morphology and Xrd Analysis Of Alnsupporting
confidence: 91%
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“…The root mean square roughness (RMS) value for 0 sec, 30 sec, 60 sec and 90 sec TMAl preflow were 3.42 nm, 3.09 nm, 4.48 and 6.28 nm. The non-linear relation of TMAl preflow and surface roughness was in agreement to those reported by Jianxing Cao et al [6]. It was observed, the surface of AlN with 0 sec TMAl preflow covered by small grain and small pits.…”
Section: A Surface Morphology and Xrd Analysis Of Alnsupporting
confidence: 91%
“…Yet, there still many challenging problems need to be solved i.e large mismatch in lattice parameter, thermal stress due to different thermal expansion coefficient, plastic deformation of silicon and melt back etching. Various thin films such as AlAs [4], SiC [5], AlN [6] and SCN [7] has been introduced as Gan buffer layer to reduce the large tensile stress and meltback etching for GaN epitaxy on Si. AlN is commonly adopted buffer layer due to its small lattice constant and its large band gap.…”
Section: Introductionmentioning
confidence: 99%
“…For epitaxial growth of AlN on (111) Si with trimethylaluminium (TMAl) and NH 3 precursors, some groups have used an Al pre-deposition step using TMAl before AlN growth. [17][18][19] The knowledge of high temperature CVD growth of AlN on (111) Si has been adopted for CVD growth of hBN on (111) Si in this work.…”
mentioning
confidence: 99%
“…For the growth of AlN by sputtering, a previous report suggested that Al termination improved the AlN film surface and reduced defects. 17 We also demonstrated the deposition of an all-sputtered GaN/AlN film onto a Si(111) substrate at a substrate temperature below 650 °C. 18 To increase the value of GaN on AlN/Si substrates, it is necessary to achieve the same polarity control as that achieved for GaN on other template substrates such as c-sapphire.…”
Section: Introductionmentioning
confidence: 94%