2014
DOI: 10.1016/j.egypro.2014.08.055
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The Influence of Orientation and Morphology on the Passivation of Crystalline Silicon Surfaces by Al2O3

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Cited by 15 publications
(5 citation statements)
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“…Unlike [209] we are able to obtain clear results in this respect. This work was previously published in [210].…”
Section: Recombination At 100 111 and Textured Surfacesmentioning
confidence: 99%
“…Unlike [209] we are able to obtain clear results in this respect. This work was previously published in [210].…”
Section: Recombination At 100 111 and Textured Surfacesmentioning
confidence: 99%
“…First of all, the different crystal orientation ( 111 for textured versus 100 for polished) enhances recombination intrinsically because of the higher amount of dangling bonds in 111 surfaces compared with 100 surfaces. As a reference, the J 0e ratio between polished 111 and 100 surfaces (J 0e,pol 111 /J 0e,pol 100 ) has been estimated to be around 1-1.2 for annealed APCVD Al 2 O 3 layers [38]. Another potential factor, which is particularly difficult to quantify, is the existence of additional defects associated with enhanced stress at the edges and vertices of the pyramidal structure [39].…”
Section: B Impact Of Back-end Processing On Al 2 O 3 /Sio X Passivationmentioning
confidence: 99%
“…In addition, the Auger contribution could be slightly higher at textured surfaces than planar surfaces because of increased doping at pyramidal tips [40]. These additional factors can be encompassed in the J 0e ratio between textured 111 and polished 111 surfaces (J 0e,text 111 /J 0e,pol 111 ), which was estimated to be around 2.2-2.6 for APCVD Al 2 O 3 layers [38] and, hence, suggests that these additional effects are more relevant than the impact of surface orientation.…”
Section: B Impact Of Back-end Processing On Al 2 O 3 /Sio X Passivationmentioning
confidence: 99%
“…In order to overcome this, Al 2 O 3 coating can be used as the protective material for silicon [6][7][8][9][10][11][12][13][14][15][16]. The porous silicon can be prepared by conventional electrochemical anodization using silicon wafer as a working electrode.…”
Section: Introductionmentioning
confidence: 99%