The flexible bandpass filter on polyimide substrate for wireless communications systems

Gong, Jun-Shuai; Wang, Zhiliang; Qu, Huiwen; Cang, Dingyong

doi:10.1088/1361-6641/ac3188

Cited by 5 publications

(3 citation statements)

References 21 publications

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“…Among polymer substrates, polyimide (PI) has outstanding comprehensive properties, including high-temperature resistance, excellent mechanical strength and flexibility, high radiation and wear stability. Therefore, the PI substrate has been widely used in flexible bandpass filters of wireless communications [ 1 , 2 ], thin-film transistors of flexible organic light-emitting diodes (OLEDs) [ 3 , 4 ], solar cells [ 5 ] etc. [ 6 , 7 ].…”

Section: Introductionmentioning

confidence: 99%

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Lian

Zhao

et al. 2023

Polymers

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Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly “twisted” 4,4′-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

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Section: Introductionmentioning

confidence: 99%

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Lian

Zhao

et al. 2023

Polymers

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“…Semiconductor materials based filters have attracted more and more researchers' attention, many outstanding works such as on silicon [5,6] (Si), silicon germanium [7,8] (SiGe), gallium arsenide [9] (GaAs), and other advanced semiconductor materials [10] are proposed. However, with the rapid developing of the wireless communication systems, the first and second generation semiconductors are getting to be hard to satisfying the demand of the frequency and power.…”

Section: Introductionmentioning

confidence: 99%

Terahertz monolithic integrated narrow-band filter based on the silicon carbide substrate

Liu¹,

Yang²,

Li³

et al. 2023

Semicond. Sci. Technol.

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This paper presented a narrow-band terahertz integrated cavity filter based on the silicon carbide (SiC) substrate. By introducing two metalized via-holes in a rectangular integrated cavity, an integrated coupling cavity was built, on the one hand, to operate as a coupling structure; on the other hand, to control the direct coupling between input and output feeding lines, further to control the frequency of the transmission zero. This novel approach was thoroughly investigated with attention paid to the position of the via-holes. Based on this approach, a terahertz narrow-band filter was realized on the semi-insulating SiC substrate, demonstrated good filtering performance, especially the stopband rejection characteristic, and established the groundwork for the production of the terahertz monolithic integrated circuit (TMIC).

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“…With the fast development of the fifth-generation (5G) and next-generation communications, designing millimeter-wave high-integration on-chip bandpass filters (BPFs) has been of great interest recently. Several semiconductor technologies are applied for the design of the BPFs, such as flexible polyimide substrate [1], compound column III-V [2][3][4][5][6][7][8], and SiGe/C-MOS [9][10][11][12][13][14][15][16]. Especially, the design of 60 GHz on-chip BPFs has been a hot research topic since this frequency band is a promising solution to future Gb/s wireless communication.…”

Section: Introductionmentioning

confidence: 99%

60-GHz third-order on-chip bandpass filter using GaAs pHEMT technology

Xu¹,

Weng²,

Li³

et al. 2022

Semicond. Sci. Technol.

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A 60-GHz third-order on-chip bandpass filter (BPF) based on half-mode substrate integrated waveguide (HMSIW) cavity is synthesized using GaAs pHEMT technology. Two coupling slots are etched to divide the HMSIW cavity into three resonators, and then a third-order Chebyshev BPF is designed with predicted transmission zero, return loss and bandwidth through the synthesis method. The theoretical and extracted external quality factor and coupling coefficients are used to determine the dimensions of the BPF. For demonstration, a BPF sample with a bandwidth of 29.2% is fabricated, and its simulations and measurements are in good agreement.

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The flexible bandpass filter on polyimide substrate for wireless communications systems

Cited by 5 publications

References 21 publications

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Terahertz monolithic integrated narrow-band filter based on the silicon carbide substrate

60-GHz third-order on-chip bandpass filter using GaAs pHEMT technology

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