The excitation spectrum of epoxy resins; neutron diffraction, specific heat and thermal conductivity at low temperatures

Nicholls, Christopher; Rosenberg, H. M.

doi:10.1088/0022-3719/17/7/011

Cited by 26 publications

(2 citation statements)

References 17 publications

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“…They are, however, also good thermal insulators, and current trends in encapsulating heat‐dissipating electronic components with epoxy resins have stimulate interest in the thermal conductivity of particulate filled epoxy resins. Although, epoxy resins have a low thermal conductivity (∼ 0.2 W/mK1, 2), it can be enhanced by the addition of inorganic particles with a high thermal conductivity. The electrical insulation is maintained if these particles are electrically insulating 3, 4.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

Yung

Liem

2007

J of Applied Polymer Sci

283

183

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Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (hBN) and cubic boron nitride (cBN) as fillers. The thermal conductivity of boron nitride filled epoxy matrix composites was enhanced up to 217% through silane surface treatment of fillers and multi-modal particle size mixing (two different hBN particle sizes and one cBN particle size) prior to fabricating the composite. The measurements and interpretation of the curing kinetics of anhydride cured epoxies as continuous matrix, loaded with BN having multi-modal particle size distribution, as heat conductive fillers, are highlighted. This study evidences the importance of surface engineering and multi-modal mixing distribution applied in inorganic fillered epoxy-matrix composite.

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Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

Yung

Liem

2007

J of Applied Polymer Sci

283

183

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“…In addition, it is commercially available and suitable for use with large boards. The base materials of FR4 are typically epoxy and woven fiberglass, which are the worst heat-conducting materials, with thermal conductivity of approximately 0.2-0.3 W∕mK [12,13]. The intrinsic limitation of the material thermal properties of traditional FR4 cannot meet the heat dissipation requirements.…”

Section: Introductionmentioning

confidence: 99%

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

2013

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This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. The thermal conductivity of the BN-filled substrate was measured. The temperature distribution and heat flow of the LED package were assessed by thermal profile measurement using an infrared (IR) camera and thermocouples. In addition, the heat transfer process of the LED package assembly in natural convection was also simulated using the computational fluid dynamics method. The optical performance of the LED package was monitored and investigated with various filler contents. The heat conduction mechanism in the substrate was analyzed. IR thermogram showed that the BN-doped substrate could effectively lower the surface temperature of the LED package by 21.5°C compared with the traditional FR4 substrate. According to the IESNA LM 80 lifetime testing method, reduction in LED temperature can prolong the LED's lifetime by 19,000 h. The optical performance of the LED package assembly was also found to be improved significantly in lighting power by 10%. As a result, the overall heat dissipation capability of the LED package to the surrounding is enhanced, which improves the LED's efficacy.

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Thermal conductivity and specific heat of an epoxy resin/epoxy resin composite material at low temperatures

Scheibner

Jäckel

1985

phys. stat. sol. (a)

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The thermal conductivity and the specific heat of pure and filled epoxy resins are measured in the temperature range between 2 and 80 K. In order to study the low‐temperature thermal conductivity of the filled samples without any acoustic mismatch a filler completely identical with the matrix material is used. The characteristic plateau of the thermal conductivity of amorphous solids between 5 and 15 K is extented to elevated temperatures with growing filler content. A second plateau of the thermal conductivity between 30 and 50 K is observed. It is suggested that the second plateau arises from a mechanism which is due to the anisotropic bending forces in polymers and related materials.

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The excitation spectrum of epoxy resins; neutron diffraction, specific heat and thermal conductivity at low temperatures

Cited by 26 publications

References 17 publications

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

Thermal conductivity and specific heat of an epoxy resin/epoxy resin composite material at low temperatures

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