2013
DOI: 10.1364/ao.52.008484
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Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

Abstract: This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. The thermal conductivity of the BN-filled substrate was measured. The temperature distribution and heat flow of the LED package were assessed by thermal profile measurement using an infrared (IR) camera and thermocouples. In addition,… Show more

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Cited by 16 publications
(6 citation statements)
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References 26 publications
(31 reference statements)
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“…Thus, managing the thermal effect is critical in extending the lifetime of a pc-WLED. Generally, the junction temperature of the LED die is considered an indicator of the thermal condition in both academia and industry 1521 . However, the junction temperature of the LED die is not strongly correlated with the temperature in the phosphor layer.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, managing the thermal effect is critical in extending the lifetime of a pc-WLED. Generally, the junction temperature of the LED die is considered an indicator of the thermal condition in both academia and industry 1521 . However, the junction temperature of the LED die is not strongly correlated with the temperature in the phosphor layer.…”
Section: Introductionmentioning
confidence: 99%
“…However, recent findings have shown that performance can be compromised by illumination variations caused by ineffective heat dissipation, especially considering that the emitted peak wavelength is highly dependent on the core temperature of the LED (9). With an increase in core temperature, the emitted peak wavelength will be a higher, less favorable wavelength for photosensitizer excitation of IRDye (LI-COR Biosciences) 700DX, which is commonly used as a preclinical PIT agent (7,10).…”
mentioning
confidence: 99%
“…The application of IR thermography can be seen for the thermal inspection of various types of LEDs, including chip on board (COB) [ 104 ], surface mounted devices (SMD) [ 105 ], and flip-chips [ 106 ]. This method is widely preferred for various thermal management-related problems in LEDs [ 107 , 108 , 109 , 110 , 111 , 112 ]. The basic principle of IR thermography is to capture electromagnetic radiation emitted from the surface of objects in the IR spectrum and monitor the corresponding 2D temperature maps.…”
Section: Optical Temperature Probing Methodsmentioning
confidence: 99%