The present paper presents a proceeding to prepare partially conductive textile structures as basic substrates to integrate sensors and microelectronic devices into textiles. The proceeding is based on two steps. The first is to create a textile prestructure by conventional textile technologies, such as Jacquard weaving, embroidery etc. using silver-coated polyamide threads. The second is a galvanic and/or electrochemical treatment of the textile prestructure. It will be shown that galvanic and electrochemical treatment of such structures permit a change in the conductivity of two to three orders of magnitude, modification of the surface as it is needed to get sensor properties, and insulation or encapsulation of the conducting structure.

The thermal conductivity and the specific heat of pure and filled epoxy resins are measured in the temperature range between 2 and 80 K. In order to study the low‐temperature thermal conductivity of the filled samples without any acoustic mismatch a filler completely identical with the matrix material is used. The characteristic plateau of the thermal conductivity of amorphous solids between 5 and 15 K is extented to elevated temperatures with growing filler content. A second plateau of the thermal conductivity between 30 and 50 K is observed. It is suggested that the second plateau arises from a mechanism which is due to the anisotropic bending forces in polymers and related materials.

The thermal conductivity and the specific heat of several polymers and related materials are found to be not smooth functions in the temperature range between 30 and 50 K. A low‐temperature anomaly is observed. In the same temperature range, the mechanical and dielectric relaxation spectra of many polymers exhibit a cryogenic relaxation. It is suggested that both the cryogenic relaxation process and the anomaly of the thermal properties near 50 K are independent of the detailed chemical composition of the material and arise from the anisotropy of bonding forces in chain‐like or network‐like structures.

NeBergebnisse der Warmeleitfahigkeit von reinem und kreidegefiilltem Polyethylen hoher Dichte zwischen 2 und 20 I< werden vorgestellt. Die Abweichungen zwischen gemessenen und aus Mischungsformeln berechneten Warmeleitfahig-Iceiten sind auf Aggregatbildung von Fullstoffpartikeln zuriickzufiihren. Ausgehend davon wird vorgeschlagen, Warmeleitfahigkeitsmessungen bei tiefcn Temperaturen zur quantitativen Bestimmung der Aggregatbildung in gefullten Polymeren zu benutzen. Tennonposoduocmb uanoaneuuhhx nofiwmuneuos npu U U~X U X mefinepamypaxO I I p e g e J e H a TenJIOnpOBOAHOCTb YHCTOrO EI HanOJIHeHHOrO Kap6OHaTOM KaJIbuEIH IIOJIEIaTMJleHa BbICOKOa IIJIOTHOCTEl B 0 6 n a c~~ T e M n e p a T y p OT 2 A0 20 H. k l 3 M e p e H H b I e EI BbIYHCJleHHbIe no T e O P H H Te~JlOIlpOBOAHOCTH BeJIkIWiHbI pas-JIElYaIOTCR B p e 3 y J I b T a T e TOI'O, YTO @OpMHpYH)TCR a r p e r a T b I saCTElII HaIlOJIHMTeJIfI. n p e A J I a r a e T C R BOaMOXHOCTb KOJIHYeCTBeHHOI'O OIlpeaeJIeHHR CTeneHEl @OpMElpOBaHEIH a r p e r a T 0 B C IIOMOUbH) EI3MepeHElH TenJIOIIpOBOAHOCTHHaIlOJIHeHHbIX nOJIHMepOB IlpEl HEl3KElX T e M n e p a T y p a X . IIeat conductivity of filled polyethylenes at low temperaturesHeat conductivity data of pure and high density polyethylene filled with calcium carbonate in the temperature range hetween 2 and 20 K are presented. Differences between experimental data and on the basis of mixture rules computed heat conductivities are related to the pressence of agglomerates of filler particles. Based on these data it is proposed to usc heat conductivity measurements for the determination of the state of agglomeration in filled polymers.

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