1978
DOI: 10.1016/0038-1101(78)90293-9
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The energy levels and the defect signature of sulfur-implanted silicon by thermally stimulated measurements

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Cited by 15 publications
(5 citation statements)
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“…Tin was studied in particular as a dopant to improve the radiation resistance of c-Si devices, but was also found to form midgap states in Si [49,50]. Finally, sulfur was studied notably in "black silicon" processing, where it was found that its incorporation creates deep bandgap states, which increase the infrared light absorption in Si, making it appear more "black" [46,51,52].…”
Section: The Need For a Diffusion Barrier Layermentioning
confidence: 99%
“…Tin was studied in particular as a dopant to improve the radiation resistance of c-Si devices, but was also found to form midgap states in Si [49,50]. Finally, sulfur was studied notably in "black silicon" processing, where it was found that its incorporation creates deep bandgap states, which increase the infrared light absorption in Si, making it appear more "black" [46,51,52].…”
Section: The Need For a Diffusion Barrier Layermentioning
confidence: 99%
“…It is likely that, in bulk doping from a limited volume (as in the case under consideration), crystal defects can hinder uniform saturation of the crystal bulk with the impurity. The same difficulty may be encountered when the other method is used, in which diffusion is performed from a limited volume, with ion implantation of silicon with sulfur and the subsequent high-temperature up-diffusion of the impurity [13]. Therefore, we chose as the main technological procedure for fabrication of detectors, the method of silicon doping with sulfur by high-temperature diffusion of the element from the vapor phase in sealed ampoules.…”
Section: Properties Of the Samples Obtainedmentioning
confidence: 98%
“…This method includes two stages, in the first of which sulfur is introduced into the surface layer of a crystal. This can be done at room temperature by the ion implantation technique [13], or in the course of the diffusion process at comparatively low temperatures [14]. The next stage of the doping process occurs when sulfur buried in the surface layer diffuses into the bulk of the crystal, which is usually done in an open tube of a high-temperature furnace.…”
Section: Introductionmentioning
confidence: 99%
“…Sulfur-doped silicon (Si:S) has been extensively studied (see, e.g., [1][2][3][4][5]). It is known that the introduction of sulfur into silicon yields a number of donor centers, including simple substitution centers (S 1 ), as well as centers composed of a pair of sulfur atoms that occupy two neighboring substitution positions in the silicon lattice (S 2 ).…”
Section: Introductionmentioning
confidence: 99%
“…Sulfur has been introduced into silicon by various methods: diffusion from the gas phase in sealed ampoules [1,2,5], including that with a radioactive isotope of sulfur, 35 S [8], and implantation followed by a high-temperature treatment of samples [3,4]. Another double-stage technique includes preliminary doping of the surface of a silicon wafer with sulfur from a surface layer of a diffusant-containing organic substance at comparatively low temperatures.…”
Section: Introductionmentioning
confidence: 99%