2000
DOI: 10.1016/s0040-6090(00)01063-4
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The effects of growth temperature on the microstructure and electrical barrier height in PtSi/p-Si(100) Schottky barrier detector

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Cited by 5 publications
(2 citation statements)
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“…Schottky contacts themselves have been utilized as a rectifier and a simple photodetector (e.g. in thermal imaging devices) [91][92][93][94][95] while Ohmic contacts are needed for many devices to transmit the electric current through a device p-n junction structure with a minimized resistance [88,89,96,97]. Two parameters should be minimized in high-quality Ohmic contacts: contact resistivity and carrier recombination (or generation).…”
Section: Trade-off Between Ohmic and Recombination Losses At Metal-se...mentioning
confidence: 99%
“…Schottky contacts themselves have been utilized as a rectifier and a simple photodetector (e.g. in thermal imaging devices) [91][92][93][94][95] while Ohmic contacts are needed for many devices to transmit the electric current through a device p-n junction structure with a minimized resistance [88,89,96,97]. Two parameters should be minimized in high-quality Ohmic contacts: contact resistivity and carrier recombination (or generation).…”
Section: Trade-off Between Ohmic and Recombination Losses At Metal-se...mentioning
confidence: 99%
“…Since the concept of silicide Schottky-barrier detector focal plane arrays (FPAs) was proposed by Shepherd and Yang in 1973 [1], the silicide/Si FPA has become one of the most mature technologies for large-area, high-density FPAs for many short-wavelength infrared (SWIR, 1-3 µm) and middlewavelength infrared (MWIR, 3-5 µm) applications. This is due primarily to its process compatibility with silicon very large scale integration (VLSI) [2][3][4]. PtSi/Si FPAs are used for imaging in the MWIR region.…”
Section: Introductionmentioning
confidence: 99%