2009
DOI: 10.1016/j.jiec.2008.08.012
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The effect of Ne+ ion implantation on polyimide film

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Cited by 12 publications
(8 citation statements)
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“…The XPS spectrum of N 1s was deconvoluted into two peaks with the binding energies centered at about 397.34 and 399.98 eV. The peak at the lowest binding energy at 397.34 eV can be attributed to the carbon atoms from the aromatic ring bonded with the imine type of nitrogen atoms whereas the highest energy contribution at 399.98 eV may be attributed to sp 2 carbon atoms bonded to NH 2 groups [27].…”
Section: Characterization Of Carbon Materialsmentioning
confidence: 99%
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“…The XPS spectrum of N 1s was deconvoluted into two peaks with the binding energies centered at about 397.34 and 399.98 eV. The peak at the lowest binding energy at 397.34 eV can be attributed to the carbon atoms from the aromatic ring bonded with the imine type of nitrogen atoms whereas the highest energy contribution at 399.98 eV may be attributed to sp 2 carbon atoms bonded to NH 2 groups [27].…”
Section: Characterization Of Carbon Materialsmentioning
confidence: 99%
“…Prepared mesoporous carbons such as Su-OMC and N-OMC showed fast charge-discharge responses at the beginning of both positive and negative sweeps. It has been accepted that when the ions are more easily accessible to the electrochemically active surface, the charge-discharge characteristics are faster, even at a high voltage sweep rate [27], which is important for reversibility of electrochemical capacitors. It is believed that the pore structures of mesoporous carbons, which have large pore sizes with a narrow pore-size distribution, favor ionic penetration into pores and thereby lead to the fast chargedischarge characteristics found for OMC and N-OMC [11][12][13].…”
Section: Capacitive Properties Of Carbon Materialsmentioning
confidence: 99%
“…14,15 However, these methods tend to be detrimental to the intrinsic properties of PI films. 16 Besides, generally, there are complicated procedures involved in these methods. Relatively, heat-sealing technique is a facile method for bonding films, which needs just a thermal-pressing step followed by a cooling procedure.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome this nonadhesive obstacle, much efforts have been made, including physical or chemical surface treatments 11,12 and surface coating with additional polymers (polytetrafluoroethylene, acrylic resin, etc.). 13,14 However, these methods tend to endow PIs with good adhesiveness at the expense of their intrinsic properties, 15 such as the deterioration of mechanical strength or thermal stability, due to the surface damage or the inferior thermal resistance of coating materials. Besides, generally, there are complicated procedures involved in these methods.…”
Section: Introductionmentioning
confidence: 99%