“…One of the strategies that researchers have most used is to add elements to enhance the properties of the lead-free solder alloys. [6][7][8][9][10][11][12][13][14] Based on advantages of small supplemented elements, new lead-free solders have been created to obtain improved overall properties (strength and reliability under severe operation conditions). Many studies found in the literature have demonstrated that the behaviours of the lead-free solders are indeed improved by small additions of Cu, Ni, Fe, Ce, Sb, Zn and so forth.…”
Section: Introductionmentioning
confidence: 99%
“…Many studies found in the literature have demonstrated that the behaviours of the lead-free solders are indeed improved by small additions of Cu, Ni, Fe, Ce, Sb, Zn and so forth. [7][8][9][10][11][12][13][14][15][16] Furthermore, in automotive industry particularly, a novel lead-free solder, namely, InnoLot, has been created based on SAC387 solder with three small supplements of bismuth (Bi), antimony (Sb) and nickel (Ni). [17][18][19][20] The beneficial effects of these elements addition to tin-silver-copper (SAC) solder materials have been showed in previous studies.…”
Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The temperature-modified Coffin
“…One of the strategies that researchers have most used is to add elements to enhance the properties of the lead-free solder alloys. [6][7][8][9][10][11][12][13][14] Based on advantages of small supplemented elements, new lead-free solders have been created to obtain improved overall properties (strength and reliability under severe operation conditions). Many studies found in the literature have demonstrated that the behaviours of the lead-free solders are indeed improved by small additions of Cu, Ni, Fe, Ce, Sb, Zn and so forth.…”
Section: Introductionmentioning
confidence: 99%
“…Many studies found in the literature have demonstrated that the behaviours of the lead-free solders are indeed improved by small additions of Cu, Ni, Fe, Ce, Sb, Zn and so forth. [7][8][9][10][11][12][13][14][15][16] Furthermore, in automotive industry particularly, a novel lead-free solder, namely, InnoLot, has been created based on SAC387 solder with three small supplements of bismuth (Bi), antimony (Sb) and nickel (Ni). [17][18][19][20] The beneficial effects of these elements addition to tin-silver-copper (SAC) solder materials have been showed in previous studies.…”
Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The temperature-modified Coffin
“…These results are in good agreement with previous findings made for other solder alloys that contain Bi, Ni, and Sb elements. 43–50 Figure 6.The shear stress–shear strain curves at 25℃ and for three strain rates for: (a) SACBiNi and (b) Innolot solder joints.Figure 7.The shear stress–shear strain curves at strain rate of 2.0 × 10 −4 s −1 and for three temperatures for: (a) SACBiNi and (b) Innolot solder joints.Figure 8.The ultimate shear strength under three strain rates and three temperatures for: (a) SACBiNi and (b) Innolot.…”
This paper makes a focus on the design of a micro-testing machine used for evaluating the mechanical properties of solder alloys. The different parts of the testing device have been developed and assembled in a manner that will facilitate the study of miniature solder joints as used in electronic packaging. A specific procedure for fabricating miniature lap-shear joint specimens is proposed in this work. The tests carried out with the newly developed machine serve to determine the material behavior of solder joints under different controlled loading and temperature conditions. Two new solder alloys, namely SACBiNi and Innolot, are characterized in the study, showing the influence of strain rate and temperature parameters on their respective mechanical responses. In addition, the as-cast and fracture surfaces of the solder joints are observed with a scanning electron microscope to reveal the degradation mechanisms. The SACBiNi solder alloy, which contains less Ni and Sb elements, is found to have smaller shear strength than the Innolot alloy, while its elongation to rupture is significantly improved at the same strain rate level and testing temperature. The highest shear strength is 58.9 MPa and 61.1 MPa under the shear strain rate of 2.0 × 10−2 s−1 and room temperature for the SACBiNi and Innolot solder joints, respectively. In contrast, the lowest shear strength values, 26.6 MPa and 29.5 MPa for SACBiNi and Innolot, respectively, were recorded for the strain rate value of 2.0 × 10−4 s−1 and at temperature of 125℃.
“…. [1][2][3][4][5]. The behaviors of these solders have been found to be particularly dependent on the amount of the reactive constituent element of the solders.…”
Newly developed lead-free solder alloys, which contain doping some elements such as Ni, Bi, Sb, Al, ... have improved properties with respect to the conventional solder alloys, particularly in terms of resistance to creep. Their high performances are specifically desired in applications of power electronics where they are used for the electrical interconnections between the components. Up to now, studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. In this study, rupture of notched SENT specimens fabricated from the InnoLot lead-free solder alloy is investigated. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation (DIC). The images are taken at successive steps of deformation and the displacement field is measured in a region of interest (ROI) which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams’ solution. In addition, the stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams’s expansion series, are examined in the study. Finally, a method is also proposed for the automatic crack tip detection
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