The Effect of Gold-Tin Intermetallic Compound on the Low Cycle Fatigue Behavior of Copper Alloy C72700 and C17200 Wires

Fox, A; Davis, Mackenzie; White, Paul; Palumbo, T.; Mattoe, C. A.

doi:10.1109/tchmt.1986.1136650

Cited by 11 publications

(1 citation statement)

References 2 publications

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“…[11] One of the problems associated with the use of Au-Sn alloys for joining has been associated with the presence of Au-Sn intermetallics. [12,13,14] The formation of Au-Sn intermetallics has been reported to reduce the fatigue lives of solder joints; however, this has been attributed primarily to the tin-rich phases. In this study, the kinetics of TLP solidification kinetics in the Au-Sn system has been examined experimentally.…”

Section: Introductionmentioning

confidence: 99%

Experimental study of the kinetics of transient liquid phase solidification reaction in electroplated gold-tin layers on copper

Venkatraman

Wilcox²,

Cain³

1997

Metall Mater Trans A

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The kinetics of transient liquid phase (TLP) solidification in Au-Sn layers electroplated on Cu foil was investigated using differential scanning calorimetry (DSC). The solidification reaction takes place between a eutectic liquid of melting point 280 ЊC, which is shown to form in preference to other compositions, and an excess gold-rich layer. The solidification kinetics and the amount of melt formed were measured as a function of foil aging time. It is shown that the well-documented rapid interdiffusion at low temperatures between gold and tin can account for a decrease in the amount of melt produced during heating with age time. An estimate of the effective diffusivity of tin into gold at 295 ЊC has been obtained from measured solidification rates. The effect of copper diffusing through the gold film on the solidification kinetics was also investigated.

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Section: Introductionmentioning

confidence: 99%