Modern manufacturing processes have extremely miniscule tolerances, a common process being that of thermal uniformity. Uniformly heated instrumentation systems are generally expensive, inefficient, unpredictable, large and bulky. Current manufacturing methods require increasingly demanding accuracy and precision. Engineers rely on these technologies to move cutting edge development forward. Any improvement in facilitating these processes can have immediate and wide-ranging impact. Some of these manufacturing processes require thermally narrow process windows. These include powder bed fusion, thermoforming, solder re-flow, and resin curing. The current solutions are extremely large and expensive. The need is for a smaller format, cost efficient solution to these manufacturing problems and processes so that they can be easily purchased for small companies, educational facilities, as well as at home use. The objective of this research is to build a sub-system that creates a thermally stable and uniform bed temperature which can be used for many applications and to explore different ways to test the design and analyse the data.
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