The development of advanced linear induction motor systems

Bellamy, G.; Lewis, E.A.

doi:10.1049/cp:20040404

Cited by 3 publications

(2 citation statements)

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“…Therefore, PPIs have been developed in recent years to replace thyristors and gate turn-off thyristors (GTOs) in traction systems [53], [54], large motor drives [55]- [57], power systems [58]- [60], and pulsed power applications [61]. The reliability record for press-pack devices is much higher than power modules largely due to a better tolerance to thermal cycling: the press pack allows double-sided cooling to lower the thermal impedance [56], [62]. However, the cooling for the press-pack device relies on oil or another deionized liquid, to prevent the coolant from conducting current [62].…”

Section: Package-related Failure Mechanismsmentioning

confidence: 99%

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang

Xiang

Bryant

et al. 2010

IEEE Trans. Power Electron.

992

348

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Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

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Section: Package-related Failure Mechanismsmentioning

confidence: 99%

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang

Xiang

Bryant

et al. 2010

IEEE Trans. Power Electron.

992

348

View full text Add to dashboard Cite

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“…The machine topologies mainly considered for EML are a double-sided linear induction motor (LIM) [1], a double-sided tubular induction motor [2], and a linear permanent magnet synchronous motor (LPMSM) [3]. In order to achieve the high thrust requirement for aircraft launch applications these machines need to operate with a high current density.…”

Section: Introductionmentioning

confidence: 99%

Thermal Design of Linear Induction and Synchronous Motors for Electromagnetic Launch of Civil Aircraft

Bertola

Cox

Wheeler

et al. 2017

IEEE Trans. Plasma Sci.

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A note on versions:The version presented here may differ from the published version or from the version of record. If you wish to cite this item you are advised to consult the publisher's version. Please see the repository url above for details on accessing the published version and note that access may require a subscription.For more information, please contact eprints@nottingham.ac.uk This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. Abstract-The engine size of modern passenger transport aircraft is principally determined by take-off conditions, since initial acceleration requires maximum engine power. An electromagnetic launch (EML) system could provide some or all of the energy required at takeoff so that the aircraft engine power requirement and fuel consumption may be significantly reduced. So far, EML for aircraft has been adopted only for military applications to replace steam catapults on the deck of aircraft carriers. This paper will describe the potential application of EML to propel civil aircraft on the runways of modern airports. A comparison of synchronous and asynchronous electrical motor systems designed to launch an A320-200 sized aircraft is presented. The paper also describes a solution of the transient heat transfer problem applied to the conductive components of EML systems.

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