1981
DOI: 10.1149/1.2127324
|View full text |Cite
|
Sign up to set email alerts
|

The Deposition of Silicon Films by Pyrolytic Decomposition of SiF2 Gas

Abstract: Production of silicon films by a silicon fluoride transport reaction is described here. The effect of various deposition parameters including temperature, partial pressure, and gas flow rate on the deposition kinetics was investigated. X‐ray analysis, surface electron spectroscopy, optical absorbance and reflectance, and electrical measurements indicate that the films have properties similar to those of silicon films obtained by CVD from silane.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
4
0

Year Published

1982
1982
2001
2001

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 18 publications
(4 citation statements)
references
References 2 publications
0
4
0
Order By: Relevance
“…Approximately 400 W is required to obtain temperatures up to ∼1000 K. Helium buffer gas can be added to the annealing section to cause particle dilution and inhibit coalescence. In addition, small amounts of silicon tetrachloride, silicon tetrafluoride, or other halogen-containing gases can be introduced in this stage as etching reagents to assist in controlling nanocrystal formation. …”
Section: Experimental Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Approximately 400 W is required to obtain temperatures up to ∼1000 K. Helium buffer gas can be added to the annealing section to cause particle dilution and inhibit coalescence. In addition, small amounts of silicon tetrachloride, silicon tetrafluoride, or other halogen-containing gases can be introduced in this stage as etching reagents to assist in controlling nanocrystal formation. …”
Section: Experimental Methodsmentioning
confidence: 99%
“…In addition, small amounts of silicon tetrachloride, silicon tetrafluoride, or other halogen-containing gases can be introduced in this stage as etching reagents to assist in controlling nanocrystal formation. [67][68][69][70][71] The cluster cations then enter a combined nozzle and ion optics assembly that allows for the formation and subsequent focusing of a cluster ion beam. No external ionization source is used, the cluster ions result from the photolysis laser.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…According to the blank reaction of SiF 2 , we know that a disproportionation reaction occurs for SiF 2 between 400 and 800 ³C. 4,12 However, in the reaction between SiF 2 and WF 6 , polycrystalline silicon is obtained only at temperatures between 500 and 800 ³C with no polycrystalline silicon obtained at 400 ³C. These results indicate that the disproportionation reaction does not compete with the reduction reaction at ¡400 ³C.…”
Section: Resultsmentioning
confidence: 98%
“…It is known that the disproportionation reaction of SiF 2 proceeds in the temperature range 400±800 ³C. 7 The reaction is kinetically favored but thermodynamically disfavored as the reaction temperature increases. >From our previous studies, it occurs that the optimal reaction temperature seems to be 650 ³C.…”
Section: Resultsmentioning
confidence: 99%