The BOOM Project: Towards 160 Gb/s Packet Switching Using SOI Photonic Integrated Circuits and Hybrid Integrated Optical Flip-Flops

Stamatiadis, C.; Gomez-Agis, Fausto; Stampoulidis, L.; Vyrsokinos, K.; Lazarou, Ioannis; Dorren, H.J.S.; Zimmermann, Lars; Voigt, K.; Thourhout, Dries Van; Heyn, Peter De; Avramopoulos, H.

doi:10.1109/jlt.2011.2175901

Cited by 6 publications

(1 citation statement)

References 16 publications

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“…Two main approaches to bridge the gap between a typical fiber mode size and a silicon waveguide mode size have been pursued, both edge and vertical grating couplers. In the first case, the coupling mechanism involves the employment of a lensed fiber to focus the light directly to the small spot size of the silicon waveguide at the input side and then to refocus the diverging light transmitted in the silicon waveguide at the output side 1,2 . However, this method may still result in inefficient coupling (the light has to be focused down to sub-micrometer scale) and in very fine alignment tolerances.…”

Section: Optical Coupling To Silicon Waveguidesmentioning

confidence: 99%

Packaging challenges for integrated silicon photonic circuits

Pavarelli¹,

Lee²,

O’Brien³

2014

Silicon Photonics and Photonic Integrated Circuits IV

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Cost-effective packaging of silicon photonic devices presents a significant bottleneck to commercialization of the technology. One way of addressing this packaging challenge is to use techniques that have been developed by the electronics industry and which also benefit from the use of advanced electronics assembly equipment. Even packaging processes such as fiber coupling can benefit from this approach, along with the hybrid integration of devices such as electronic components (e.g. modulator driver integrated circuits). In this paper, we will present developments made by our group towards achieving scalable fiber and electronic packaging processes that rely on electronic assembly techniques such as flip-chip assembly. We will also provide an overview of packaged prototypes being developed within our group for telecom and sensing applications and how these packaging technologies are now being made available to users through the ePIXfab foundry service.

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Section: Optical Coupling To Silicon Waveguidesmentioning

confidence: 99%