2005
DOI: 10.1117/12.604309
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Terahertz sources and detectors

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Cited by 26 publications
(11 citation statements)
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“…In the case of the discrete diode chip, the diodes are flip−chip mounted into the circuit with either solder or conductive epoxy. Using advanced techno− logy elaborated recently, the diodes are integrated with many passive circuit elements (impedance matching, filters and waveguide probes) onto the same substrate [105]. By improving the mechanical arrangement and reducing loss, the planar technology is pushed well beyond 300 GHz up to several THz.…”
Section: Pyroelectric Detectormentioning
confidence: 99%
“…In the case of the discrete diode chip, the diodes are flip−chip mounted into the circuit with either solder or conductive epoxy. Using advanced techno− logy elaborated recently, the diodes are integrated with many passive circuit elements (impedance matching, filters and waveguide probes) onto the same substrate [105]. By improving the mechanical arrangement and reducing loss, the planar technology is pushed well beyond 300 GHz up to several THz.…”
Section: Pyroelectric Detectormentioning
confidence: 99%
“…The Schottky diode based on epitaxial electron-doped gallium arsenide (n-GaAs) is probably the most important microelectronic device for operation in the sub-millimeter waves and terahertz (THz) range. 1,2 Diode areas of the order of 1 lm 2 are needed to obtain a low junction capacitance C j $ 10 À15 F, which was classically achieved by pressing etched tungsten whiskers on GaAs chips. In the last decade, planar diodes with air-bridge lithographic anodes and high cutoff frequency f c ¼ 1/2pR s C j (R s series resistance) have been developed and are playing a prominent role in sophisticated THz spectroscopic instruments such as heterodyne mixers and frequency multiplied oscillators.…”
mentioning
confidence: 99%
“…1(a) and 1(b), in both cases, the sub-micrometric Schottky junction is achieved by contacting the GaAs surface with the extremity of a free-standing metal bridge. 1,2,11,13 To cut parasitic capacitances, deep mesa isolation was performed between anode and cathode pads, then working as the arms of a planar antenna. 2,14 The difference between the two types of devices lies only in the three-dimensional geometry of the sub-micron metal-semiconductor junction, which actually allowed us to tune the Schottky barrier thickness and hence the tunneling probability.…”
mentioning
confidence: 99%
“…Above approximately 1:0 THz, the spectral signatures of many explosive solid materials are available for capture [5] by using, e.g., THz time-domain spectroscopy (THz-TDS) for imaging [4]. Recent advances in THz generation and detection technologies [6] enable the design and development of more compact and potentially portable THz imaging systems. Substantial stand-off threat detection-discrimination will be a crucial aspect of all future THz-based security imaging systems intended to effectively counter today's asymmetric terrorist threats.…”
Section: Introductionmentioning
confidence: 99%