Temporary Carrier Technologies for eWLB and RDL‐First Fan‐Out Wafer‐Level Packages

Keser, Beth; Kroehnert, Steffen

doi:10.1002/9781119313991.ch21

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Laser Lift‐off For Emerging Electronics1

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2022

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“…Moreover, excessive carbonization of the adhesive can also increase local heat accumulation and scattering, thereby increasing the degree of carbonization by nonlinearly increasing the local temperature. [ 75 ] Therefore, it is necessary to shape the Gaussian beam of the laser into a flat‐top profile to ensure uniform exposure of the response layer. [ 73 ] In addition, the flat‐top beam with homogenized spot energy distribution used in the LLO process can prevent overexposure or underexposure of specific areas.…”

Section: Laser Lift‐off For Emerging Electronicsmentioning

confidence: 99%