Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints

Gokdeniz, Zeynep Gokce; Lederer, M.; Khatibi, Golta; Nicolics, J.

doi:10.23919/empc53418.2021.9585013

Cited by 1 publication

(1 citation statement)

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“…In general, the time-dependent plasticity of a material is greatly affected by its homologous temperature. The homologous temperature is determined by the melting point of the material, and there is a literature that time-dependent plasticity such as the creep dominates at temperatures above 50% of the melting temperature. , However, the room temperature is only 34% of homologous temperature of silver (note that the melting point of the silver is 961 °C, 1234 K), and the effect of creep is supposed to be relatively small, contrarily to the experimental result (Figure d). Several papers explain that sintered Ag shows a significant creep behavior at room temperature due to its coble creep mechanism. , Coble creep is a type of diffusion creep (i.e., dislocation creep, Nabarro–Herring creep, Coble creep, etc.…”

Section: Resultsmentioning

confidence: 95%

Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound

Jang,

Park,

Baek

et al. 2023

ACS Appl. Electron. Mater.

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In this study, the thermal shock life cycle of a wide bandgap (WBG) power module was predicted using finite element analysis considering the thermal fatigue/creep deformation of Ag sintered joints and the viscoelastic properties of epoxy molding compounds (EMCs) under periodic thermal shock conditions. To analyze the thermomechanical behaviors of the WBG power module, creep tests were carried out under continuous shear loading to evaluate the creep properties of Ag sintered joints depending on the temperature and shear stress. Also, the viscoelastic properties of fully cured EMCs were measured by conducting three-point bending stress relaxation tests. The stress/strain distributions of the power module package during the thermal shock cycles were predicted. Finally, the failure life cycle of the Ag sintered joints was calculated using the total strain–life equation based on the results of the thermal fatigue experiments. Thermal shock tests of the manufactured WBG power module were conducted to confirm the thermal fatigue cycle at which the Ag sintered joints began to be damaged. It was concluded that the failure life cycle of Ag sintered joints could be accurately predicted using the finite element (FE) simulations considering the creep and thermal fatigue properties of the Ag interconnect and the viscoelastic behavior of EMCs.

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