Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound
Yong-Rae Jang,
Sang-Jun Park,
Jeong-Hyeon Baek
et al.
Abstract:In this study, the thermal shock life cycle of a wide
bandgap (WBG)
power module was predicted using finite element analysis considering
the thermal fatigue/creep deformation of Ag sintered joints and the
viscoelastic properties of epoxy molding compounds (EMCs) under periodic
thermal shock conditions. To analyze the thermomechanical behaviors
of the WBG power module, creep tests were carried out under continuous
shear loading to evaluate the creep properties of Ag sintered joints
depending on the temperature … Show more
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