2002
DOI: 10.1134/1.1529241
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Temperature dependence of the width of the deep-level band in silicon with a high concentration of defects

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Cited by 10 publications
(12 citation statements)
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“…The article presents the results obtained for the annealing temperature of T a = 373 K. Implantation conditions and annealing temperature have been determined on the basis of earlier works [1,2]. An analysis of temperature dependences of capacity and conductivity has made it possible to estimate the values of conduction activation energy ∆E and defects relaxation time.…”
Section: Introductionmentioning
confidence: 99%
“…The article presents the results obtained for the annealing temperature of T a = 373 K. Implantation conditions and annealing temperature have been determined on the basis of earlier works [1,2]. An analysis of temperature dependences of capacity and conductivity has made it possible to estimate the values of conduction activation energy ∆E and defects relaxation time.…”
Section: Introductionmentioning
confidence: 99%
“…The experimental frequency dependences, obtained for the annealing temperature of T a = 373 K have been under discussion. Implantation conditions and annealing temperature have been determined on the basis of earlier works [6,7]. An analysis of temperature dependences of capacity and conductivity has made it possible to estimate the values of conduction activation energy ∆E and defects relaxation time.…”
Section: Introductionmentioning
confidence: 99%
“…However, in order to confirm whether the intermediate band was actually formed, it is necessary to perform further analyses. In particular, it is necessary to implement a new analytical model, which takes into consideration the phenomena associated with the thermally activated mechanisms of carrier transport as it was described in [21]. Moreover, the influence of certain parameters of ion implantation, post-implantation treatment and testing conditions should also be considered.…”
Section: Discussionmentioning
confidence: 99%