Temperature compensated LiTaO/sub 3//sapphire saw substrate for high power applications

Miura, Mika; Matsukawa, Takashi; Ueda, Masahiko; Satoh, Y.; Ikata, O.; Ebata, Y.; Takagi, Hideki

doi:10.1109/ultsym.2005.1602917

Cited by 48 publications

(46 citation statements)

References 8 publications

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“…When a stiff material with small CTE is chosen as the base substrate, the bonding suppresses the thermal expansion of the top surface where SAW propagates. Various bonding technologies such as fusion [20][21][22]28], room temperature [25][26][27][28] and adhesive [23,30,31] ones, have been investigated. Although the adhesive one seems most cost-effective, it is not clear whether the adhesive is stable during and after the device fabrication.…”

Section: B Wafer Bondingmentioning

confidence: 99%

“…As the base-substrate, Si [21][22][23]28,30,31], glass (fused quartz) [21][22][23][24][29][30][31], and sapphire [25][26][27] have been tested. Sapphire is most appropriate for the TCF improvement, but expensive.…”

Section: B Wafer Bondingmentioning

confidence: 99%

“…Although use of thick piezoelectric plate is effective for the suppression of these spurious resonances [25,27,28,30,31], it results in TCF deterioration.…”

Section: B Wafer Bondingmentioning

confidence: 99%

“…In contrast, usual materials including LN and LT become soft with T, and their intrinsic TCE and TCV are negative [19,20]. Another strategy is use of the wafer bonding of a single crystal LN/LT with a stiff substrate with small CTE [21][22][23][24][25][26][27][28][29][30][31].…”

Section: Introductionmentioning

confidence: 99%

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Recent development of temperature compensated SAW Devices

Hashimoto

Kadota

Nakao

et al. 2011

2011 IEEE International Ultrasonics Symposium

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Section: B Wafer Bondingmentioning

confidence: 99%

Section: B Wafer Bondingmentioning

confidence: 99%

“…Although use of thick piezoelectric plate is effective for the suppression of these spurious resonances [25,27,28,30,31], it results in TCF deterioration.…”

Section: B Wafer Bondingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Recent development of temperature compensated SAW Devices

Hashimoto

Kadota

Nakao

et al. 2011

2011 IEEE International Ultrasonics Symposium

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“…So, small TCF is also required in addition to moderate K 2 more than 7% to realize SAW duplexers for these systems. Recently, several device configurations have been examined and reported for the application; a conventional SiO 2 /Al/LiTaO 3 structure [1], a [6], and a wafer-bonded LiTaO 3 /sapphire substrate [7]. Moreover, the authors reported that the SAW resonator with a moderate K 2 , a zero TCF, and no Rayleigh-mode spurious response could be realized by optimizing the SiO 2 shape above the IDT and the SiO 2 thickness on a SiO 2 /Al/LiNbO 3 structure [8].…”

Section: Introductionmentioning

confidence: 99%

Suppression of transverse-mode spurious responses for zero temperature coefficient of frequency SAW resonator on a SiO<inf>2</inf>/Al/LiNbO<inf>3</inf> structure

Nakanishi

Nakamura

Tsurunari

et al. 2011

2011 IEEE International Ultrasonics Symposium

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This paper describes a suppression of transverse-mode spurious responses for zero temperature coefficient of frequency (TCF) surface acoustic wave (SAW) resonator on a SiO 2 /Al/LiNbO 3 structure. We investigated to use thinning of SiO 2 on the dummy electrodes and studied how the transverse-mode responses change with remaining SiO 2 thickness h on the dummy electrode region. As the results, we could realize high performance SAW resonator with complete suppression of the transverse-mode spurious responses when h is set at 0.20λ. It was demonstrated that the selective SiO 2 removal technique is effective to suppress transverse-mode spurious responses for SAW resonators employing the SiO 2 /Al/LiNbO 3 structure for wide range of SiO 2 thicknesses, provided that the SiO 2 thickness at the dummy electrode region is adjusted properly.

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Advanced numerical technique for analysis of surface and bulk acoustic waves in resonators using periodic metal gratings

Naumenko

2014

Journal of Applied Physics

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A numerical technique characterized by a unified approach for the analysis of different types of acoustic waves utilized in resonators in which a periodic metal grating is used for excitation and reflection of such waves is described. The combination of the Finite Element Method analysis of the electrode domain with the Spectral Domain Analysis (SDA) applied to the adjacent upper and lower semi-infinite regions, which may be multilayered and include air as a special case of a dielectric material, enables rigorous simulation of the admittance in resonators using surface acoustic waves, Love waves, plate modes including Lamb waves, Stonely waves, and other waves propagating along the interface between two media, and waves with transient structure between the mentioned types. The matrix formalism with improved convergence incorporated into SDA provides fast and robust simulation for multilayered structures with arbitrary thickness of each layer. The described technique is illustrated by a few examples of its application to various combinations of LiNbO3, isotropic silicon dioxide and silicon with a periodic array of Cu electrodes. The wave characteristics extracted from the admittance functions change continuously with the variation of the film and plate thicknesses over wide ranges, even when the wave nature changes. The transformation of the wave nature with the variation of the layer thicknesses is illustrated by diagrams and contour plots of the displacements calculated at resonant frequencies.

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Temperature compensated LiTaO/sub 3//sapphire saw substrate for high power applications

Cited by 48 publications

References 8 publications

Recent development of temperature compensated SAW Devices

Recent development of temperature compensated SAW Devices

Suppression of transverse-mode spurious responses for zero temperature coefficient of frequency SAW resonator on a SiO<inf>2</inf>/Al/LiNbO<inf>3</inf> structure

Advanced numerical technique for analysis of surface and bulk acoustic waves in resonators using periodic metal gratings

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