2011 IEEE International Ultrasonics Symposium 2011
DOI: 10.1109/ultsym.2011.0019
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Suppression of transverse-mode spurious responses for zero temperature coefficient of frequency SAW resonator on a SiO<inf>2</inf>/Al/LiNbO<inf>3</inf> structure

Abstract: This paper describes a suppression of transverse-mode spurious responses for zero temperature coefficient of frequency (TCF) surface acoustic wave (SAW) resonator on a SiO 2 /Al/LiNbO 3 structure. We investigated to use thinning of SiO 2 on the dummy electrodes and studied how the transverse-mode responses change with remaining SiO 2 thickness h on the dummy electrode region. As the results, we could realize high performance SAW resonator with complete suppression of the transverse-mode spurious responses when… Show more

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Cited by 5 publications
(5 citation statements)
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“…The best angle in this aspect depends on the electrode and SiO 2 thicknesses, widths, shape, etc. Thus the device structure including the rotation angle must be optimized for each application [17,18]. Difference of this result from that shown in Fig.…”
Section: A Sio 2 Overlaymentioning
confidence: 92%
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“…The best angle in this aspect depends on the electrode and SiO 2 thicknesses, widths, shape, etc. Thus the device structure including the rotation angle must be optimized for each application [17,18]. Difference of this result from that shown in Fig.…”
Section: A Sio 2 Overlaymentioning
confidence: 92%
“…Use of apodized IDTs is the traditional countermeasure [12,37]. Since the apodization may cause Q reduction and relatively large device size [37], various techniques were proposed as another means [17,18,38].…”
Section: A Sio 2 Overlaymentioning
confidence: 99%
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“…There are also previous research studies that investigated the effect of the deposited shape of the SiO 2 film on SAW device characteristics. [14][15][16][17][18][19] The reason why research studies on the SiO 2 film have been actively conducted is that the SiO 2 film has TCF whereby positive and negative are different from those of the substrate materials. Therefore, when it is necessary to improve the TCF of the SAW devices, the SiO 2 film for passivation is better than the Si 3 N 4 film, which has the same sign of TCF as the substrate materials.…”
Section: Introductionmentioning
confidence: 99%