Temperature- and Moisture-Induced Warpages of COG Package with Non-Conductive Paste Adhesive

Effects of localized warpage and stress on chip‐on‐glass packaging: Induced light‐leakage phenomenon in mid‐sized TFT‐LCD

“…Because of a very high ratio (~1000) of length to thickness in both glass plates, a solid-shell element (Solid-Shell 190) in ANSYS™ is employed to obtain accurate analysis, 9 while SOLID45 is used for the region far away from the edge with driver ICs. The material properties of glass, Si chip, ACF and LCD sealant used in this model are listed and summarized in 10,11 where ACF and LCD sealant are treated as temperature-dependent materials due to the viscoelastic characteristics of these polymers and their low glass-transition temperature T g . Taking into account the thermal history of COG processing, the COG bonding process in simulation is divided into three steps:…”

56.2: Distinguished Student Paper: Effects of Localized Warpage and Stress on Chip‐On‐Glass Packaging Induced Light Leakage Phenomenon in 13‐Inch TFT‐LCD

“…Because of a very high ratio (~1000) of length to thickness in both glass plates, a solid-shell element (Solid-Shell 190) was employed to obtain accurate analysis [4]. The material properties of glass, Si chip, ACF and LCD sealant used in this model were listed in Table 1 [5,6], where ACF and sealant were treated as temperature-dependent materials since they were sensitive to temperature due to their low glass transition temperature, Tg.…”

Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

“…Flip chip assembly using a non-conductive adhesive (NCA) has been recently reported [11][12][13][14][15][16][17][18][19]. This technology realizes direct electrical contact between bumps on a chip and the pads of the substrate.…”