Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Kim, Byeung-Gee; Lee, Sang-Mok; Jo, Yun-Song; Kim, Sun-Chul; Harr, Kyoung-Moo; Kim, Young‐Ho

doi:10.1016/j.microrel.2010.11.003

Cited by 17 publications

(3 citation statements)

References 30 publications

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“…In addition, the bonding process was performed at 180°C, which is a relatively low temperature. In addition, dome-shaped Sn-based bumps can effectively reduce the entrapment of NCA between the bump and the pad after the bonding process [11,17,18]. The trapped NCA can induce an increase in the contact resistance of COF joints and cause an open circuit in the worst case [17].…”

Section: Discussionmentioning

confidence: 99%

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Harr

Kim

et al. 2015

Microelectronics Reliability

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Section: Discussionmentioning

confidence: 99%

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Harr

Kim

et al. 2015

Microelectronics Reliability

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“…It has been widely used in displays and mobile handset devices [1][2][3][4][5][6][7][8][9][10][11], mainly in chip-on-flex (COF), chip-on-glass (COG), chip-on-board (COB) and chip-onplastic (COP). Recently, this type of adhesive have been applied to Si chip stacking and shown an acceptable reliability performance [12][13].…”

Section: Introductionmentioning

confidence: 99%

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Lin

Zhan

Kao

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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“…It has been widely used in displays and mobile handset devices [1][2][3][4][5][6][7][8][9][10][11], mainly in chip-on-flex (COF), chip-on-glass (COG), chip-on-board (COB) and chip-on-plastic (COP).Recently, this type of adhesive have been applied to Si chip stacking and shown an acceptable reliability performance [12]. However, the research in NCF used for chip stacking with fine pitch interconnections is seldom literatures.…”

Section: Introductionmentioning

confidence: 99%

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

Lin

Zhan

Huang

et al. 2011

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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For evaluating the feasibility of adhesive bonding by NCF (nonconductive film) in micro bump joints, three types of micro joints were adopted in this study. The structure of the type I micro joints was Cu/Ni/Au while that of the type II micro joints was Cu/Ni/Au micro bump joined with Cu/Sn solder micro bump. Both the type I and type II micro joint were bonded by using NCF. The structure of the type III micro joints were the same, but the type III micro joints were produced by eutectic bonding. For the type III micro joints, the micro gap between chips was wrapped by a capillary underfill. The bonding results revealed that the contact resistance of the NCF joints was in the range of 100 Ωm ~ 400 Ωm which was higher than that of eutectic joints. Electrical continuity of micro bump interconnection was monitored by measuring the contact resistance of four-point Kelvin structure and daisy chain during reliability test. Thermal cycling test and thermal humidity storage test were conducted to evaluate the reliability performance of these three types of micro interconnections. The reliability test displayed that the reliability performance of eutectic joints was better than that of the NCF joints. The study showed that NCF joints have great potential to be applied in low temperature bonding of fine pitch 3D IC stacking.

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Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Cited by 17 publications

References 30 publications

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

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Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Cited by 17 publications

References 30 publications

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30&#x03BC;m-pitch micro solder bump interconnections

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

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Product

Resources

About

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections