Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30&amp;#x03BC;m-pitch micro solder bump interconnections

Lin, Yu-Min; Zhan, Cheng; Kao, Kuo‐Shu; Fan, Chia-Wen; Chung, Seungjun; Huang, Yu-Lieh; Huang, Shin-Yi; Chang, Jung‐Wei; Yang, T.K.A.; Lau, John H.; Chen, Tai-Hung

doi:10.1109/ectc.2012.6249060

Cited by 6 publications

(2 citation statements)

References 12 publications

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“…However, the high bonding temperature during stacking process may lead to chip warpage caused by the mismatch of coefficient of thermal expansion among each structure of the chip. Furthermore, the warpage may also lead to stress concentration that will damage the chip [5,6]. Thus, many researches have been focused on the low temperature bonding technologies [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Mizuno

Shoji

et al. 2013

2013 3rd IEEE CPMT Symposium Japan

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Section: Introductionmentioning

confidence: 99%

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Mizuno

Shoji

et al. 2013

2013 3rd IEEE CPMT Symposium Japan

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“…Snap curing time of NCA should be considered to improve productivity in the flip-chip bonding process, which is to bond between Si chip and substrate one by one [16,17]. Additionally, hightemperature thermo-compression is accompanied by the bonding process, which causes substrate softening and the joint deterioration [18,19]. Therefore, the shear strength for interconnection between a chip and a substrate affects the reliability of the package.…”

Section: Introductionmentioning

confidence: 99%

Prediction of Curing Time/Shear Strength of Non-Conductive Adhesives Using a Neural Network Model

et al. 2022

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Electronic packaging has been developed with high resolution and fine interconnection pitches. Non-conductive adhesives (NCAs) have been growing with the increase of I/O pad count and density, along with fine pad bond pitch interconnections. Prediction and optimization of NCA characteristics are inherently complicated due to various and extensive materials composing NCAs. In this study, a framework predicting the curing time and shear strength of an NCA is established by a neural network model. NCA formulations with 4 resins, 3 hardeners, 8 catalysts, and a coupling agent were selected from in-house experiments, and an artificial neural network (ANN) with one dense layer with 3 nodes was trained using 65 data points. Model accuracy was improved by 28.9–35.2% compared with the reference, and the trained model was also verified through third-party reference data. Prediction of NCA properties and optimization of NCA formulations for mass production were demonstrated by using the trained ANN model. This paper provides a framework for ANN-based NCA design and confirmed the feasibility of ANN modeling, even with a small dataset.

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Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Sakuma¹,

Webb²,

Liu³

et al. 2016

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Abstract: Due to the raising requirements of functionality and performance in consumer electronics, high density package technology including high I/O interconnections and 3D chipstacking technology have received a great number of attentions.

Cited by 6 publications

References 12 publications

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Prediction of Curing Time/Shear Strength of Non-Conductive Adhesives Using a Neural Network Model

Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

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