Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Sakuma, Katsuyuki; Webb, Buck; Liu, Xiao Hu; Knickerbocker, John; Weiss, Thomas G.; Li, Shidong; Zhang, Hongqing; Thomas, Conor R.; Perfecto, Eric; Xu, Tingge; Lu, Hongbing

doi:10.1109/ectc.2016.191

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016

DOI: 10.1109/ectc.2016.191

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Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Katsuyuki Sakuma¹,

Buck Webb²,

Xiao Hu Liu³

et al.

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Cited by 3 publications

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Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process

Jemaa

Gagnon

Dione

et al. 2020

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Cited by 3 publications

References 16 publications

Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process

Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process

Isolate micro-bump process development and improvement

Challenge and warpage optimization of thermal compression bonding technology on coreless substrates

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