2008
DOI: 10.1088/0957-4484/19/12/125705
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Tailoring the microstructure and surface morphology of metal thin films for nano-electro-mechanical systems applications

Abstract: Metallic structural components for micro-electro-mechanical/nano-electro-mechanical systems (MEMS/NEMS) are promising alternatives to silicon-based materials since they are electrically conductive, optically reflective and ductile. Polycrystalline mono-metallic films typically exhibit low strength and hardness, high surface roughness, and significant residual stress, making them unusable for NEMS. In this study we demonstrate how to overcome these limitations by co-sputtering Ni-Mo. Detailed investigation of t… Show more

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Cited by 16 publications
(14 citation statements)
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“…Contact metals used as electrodes in piezoelectric devices should thus possess high enough tensile strength to withstand these stresses. To such effect, novel co-sputtered metal nanocomposites optimized for the fabrication of micromechanical devices have been reported [ 47 49 ]. These nanocomposites feature grain size as small as a few nanometers and residual stresses substantially lower than those of pure metals.…”
Section: Introductionmentioning
confidence: 99%
“…Contact metals used as electrodes in piezoelectric devices should thus possess high enough tensile strength to withstand these stresses. To such effect, novel co-sputtered metal nanocomposites optimized for the fabrication of micromechanical devices have been reported [ 47 49 ]. These nanocomposites feature grain size as small as a few nanometers and residual stresses substantially lower than those of pure metals.…”
Section: Introductionmentioning
confidence: 99%
“…However, fabrication of MEMS/NEMS from diamond requires rather complex lithographic procedures. For these reasons, pure metals and metallic alloys are emerging as potential candidates to replace Si compounds in certain MEMS/NEMS applications, particularly in magnetic MEMS/NEMS, which have the added value in that they can be remotely actuated 8, 9. In fact, metallic films exhibit more ductility and fracture toughness than silicon.…”
Section: Introductionmentioning
confidence: 99%
“…The main drawbacks are that their strength is usually lower than for silicon and surface roughness is often exceedingly large. This precludes conventional metallic films from being used in advanced structural components for NEMS 8. From a magnetic point of view, pure Ni, Ni 19 Fe 81 (permalloy) and CoFe‐based alloys have received attention due to their soft magnetic character 9.…”
Section: Introductionmentioning
confidence: 99%
“…For example, a similar microstructure composed of the base element less prone to significant oxidation than Al should offer improved detection sensitivity in parallel with all the advantages of an electrically conductive platform. To this end we have recently developed Au and Ni-based devices 16,17 with improved Q values over Al-Mo.…”
Section: ͑1͒mentioning
confidence: 99%