ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005.
DOI: 10.1109/iccad.2005.1560161
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System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)

Abstract: This paper proposes a new statistical response surface based power estimation technique. The new approach is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation impact on power.

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Cited by 3 publications
(1 citation statement)
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“…Many earlier works, such as Narendra et al [2004], Mukhopadhyay and Roy [2003], Rao et al [2004], and Wang et al [2005], have been proposed for full-chip statistical leakage analysis considering the process variations. When the process-induced 51:4 R. Shen et al variabilities are spatially correlated, the computational cost of the distribution of total leakage of the chip becomes quadratic -O(n 2 ), where n is number of gates as the variance of a gate has to be computed with respect to all correlated gates.…”
Section: Prior Workmentioning
confidence: 99%
“…Many earlier works, such as Narendra et al [2004], Mukhopadhyay and Roy [2003], Rao et al [2004], and Wang et al [2005], have been proposed for full-chip statistical leakage analysis considering the process variations. When the process-induced 51:4 R. Shen et al variabilities are spatially correlated, the computational cost of the distribution of total leakage of the chip becomes quadratic -O(n 2 ), where n is number of gates as the variance of a gate has to be computed with respect to all correlated gates.…”
Section: Prior Workmentioning
confidence: 99%